(19)
(11) EP 4 334 691 A1

(12)

(43) Date of publication:
13.03.2024 Bulletin 2024/11

(21) Application number: 22720195.1

(22) Date of filing: 11.04.2022
(51) International Patent Classification (IPC): 
G01K 1/143(2021.01)
G01K 1/18(2006.01)
G01K 1/08(2021.01)
(52) Cooperative Patent Classification (CPC):
G01K 1/143; G01K 1/08; G01K 1/18
(86) International application number:
PCT/US2022/024195
(87) International publication number:
WO 2022/235396 (10.11.2022 Gazette 2022/45)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(30) Priority: 06.05.2021 US 202163185028 P
23.12.2021 US 202117561103

(71) Applicant: Therm-O-Disc, Incorporated
Mansfield, Ohio 44907 (US)

(72) Inventor:
  • MOLDOVAN, Adrian
    Mansfield, Ohio 44907 (US)

(74) Representative: Bryn-Jacobsen, Caelia 
Kilburn & Strode LLP Lacon London 84 Theobalds Road
London WC1X 8NL
London WC1X 8NL (GB)

   


(54) TEMPERATURE SENSOR ASSEMBLY