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EP 4 334 973 A1

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(43) Date of publication: 13.03.2024 Bulletin 2024/11 (21) Application number: 22720269.4 (22) Date of filing: 06.04.2022

(51) International Patent Classification (IPC):  H01L 23/367(2006.01) H01L 23/00(2006.01) H01L 23/498(2006.01) H05K 1/02(2006.01) (52) Cooperative Patent Classification (CPC): H01L 23/49816; H01L 23/49827; H01L 23/3677; H01L 23/562; H05K 2201/10969; H05K 1/0209; H05K 3/3436; H01L 25/0655 (86) International application number: PCT/US2022/071577 (87) International publication number: WO 2022/236216 (10.11.2022 Gazette 2022/45)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA ME Designated Validation States: KH MA MD TN (30) Priority: 06.05.2021 US 202117313380 06.05.2021 US 202117313412 (71) Applicants: Qualcomm Technologies, Inc. San Diego, CA 92121-1714 (US) RF360 Europe GmbH 81671 München (DE)

(72) Inventors: MOREIRA, Jose San Diego, California 92121-1714 (US) VALTERE, Markus San Diego, California 92121-1714 (US) KASSTEEN, Bart San Diego, California 92121-1714 (US) TEIXEIRA DE QUEIROS, Alberto Jose San Diego, California 92121-1714 (US) (74) Representative: Pritzlaff, Stefanie Lydia  Wagner & Geyer Partnerschaft mbB Patent- und Rechtsanwälte Gewürzmühlstraße 5 80538 München 80538 München (DE)