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(11)

EP 4 335 197 A1

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(43) Date of publication: 13.03.2024 Bulletin 2024/11 (21) Application number: 22726368.8 (22) Date of filing: 06.05.2022

(51) International Patent Classification (IPC):  H04W 72/02(2009.01) H04W 72/04(2023.01) H04L 5/00(2006.01) H04W 92/18(2009.01) (52) Cooperative Patent Classification (CPC): H04W 76/14; H04W 92/18; H04W 72/02; H04L 5/0023; H04L 5/001; H04L 5/0087; H04L 5/0028; H04L 5/0033; H04L 5/0092; H04L 5/0096; H04W 72/20 (86) International application number: PCT/US2022/072179 (87) International publication number: WO 2022/236327 (10.11.2022 Gazette 2022/45)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA ME Designated Validation States: KH MA MD TN (30) Priority: 07.05.2021 US 202163201675 P 05.05.2022 US 202217662196 (71) Applicant: QUALCOMM INCORPORATED San Diego, California 92121-1714 (US)	(72) Inventors: HOSSEINI, Seyedkianoush San Diego, California 92121 (US) SARKIS, Gabi San Diego, California 92121 (US) NGUYEN, Tien Viet San Diego, California 92121 (US) (74) Representative: Bardehle Pagenberg Partnerschaft mbB Patentanwälte Rechtsanwälte  Prinzregentenplatz 7 81675 München 81675 München (DE)