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(11) | EP 4 350 054 A3 |
| (12) | EUROPEAN PATENT APPLICATION |
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| (54) | ELECTROPLATING SHIELD DEVICE |
| (57) An electroplating shield device, methods of fabricating the same, and methods of
electroplating with the electroplating shield device are disclosed herein. The method
of electroplating includes positioning an object in an electroplating shield device.
The electroplating shield device may include a conduit configured to receive the object
and a plurality of openings selectively extended between inner and outer surfaces
of the conduit. The openings may be positioned between first and second ends of the
conduit. The method may also include forming a layer on the object by transferring
fluid through the plurality of openings to at least one of a first continuous section
of the object comprising a minor of the object and a second continuous section of
the object comprising a major of the object. A ratio of a thickness of the major to
the minor after forming the layer may range from approximately 1: 1 to approximately
1:18.
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