(19)
(11) EP 4 352 277 A1

(12)

(43) Date of publication:
17.04.2024 Bulletin 2024/16

(21) Application number: 22733030.5

(22) Date of filing: 09.06.2022
(51) International Patent Classification (IPC): 
C23C 22/63(2006.01)
C25D 1/04(2006.01)
 C23C 22/73(2006.01)
H05K 3/38(2006.01)
(52) Cooperative Patent Classification (CPC):
C23C 22/63; C23C 22/73; H05K 3/385; C25D 3/38; C25D 7/123; C25D 5/48
(86) International application number:
PCT/EP2022/065620
(87) International publication number:
WO 2022/258726 (15.12.2022 Gazette 2022/50)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(30) Priority: 09.06.2021 EP 21178538

(71) Applicant: Atotech Deutschland GmbH & Co. KG
10553 Berlin (DE)

(72) Inventors:
  • SCHMIDT, Ralf
    10553 Berlin (DE)
  • WOLTER, Ingomar
    10553 Berlin (DE)
  • STEINBERGER, Gerhard
    10553 Berlin (DE)
  • HAARMANN, Philipp
    10553 Berlin (DE)
  • LÜTZOW, Norbert
    10553 Berlin (DE)
  • HÜLSMANN, Thomas
    10553 Berlin (DE)

(74) Representative: MKS IP Association 
Intellectual Property Erasmusstraße 20
10553 Berlin
10553 Berlin (DE)

   


(54) A COMPOSITE AND A METHOD FOR MANUFACTURING A COMPOSITE OF A COPPER LAYER AND AN ORGANIC LAYER