(19)
(11) EP 4 377 047 A1

(12)

(43) Date of publication:
05.06.2024 Bulletin 2024/23

(21) Application number: 21952070.7

(22) Date of filing: 28.07.2021
(51) International Patent Classification (IPC): 
B24B 53/017(2012.01)
H01L 21/67(2006.01)
B24B 37/30(2012.01)
(52) Cooperative Patent Classification (CPC):
B24B 37/30; B24B 53/017; H01L 21/67046; H01L 21/67219; H01L 21/68742; H01L 21/67028; H01L 21/68785; H01L 21/6838
(86) International application number:
PCT/US2021/043554
(87) International publication number:
WO 2023/009116 (02.02.2023 Gazette 2023/05)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(71) Applicant: Applied Materials, Inc.
Santa Clara, California 95054 (US)

(72) Inventors:
  • RANGARAJAN, Jagan
    Santa Clara, California 95054 (US)
  • GOLUBOVSKY, Edward
    Santa Clara, California 95054 (US)
  • GURUSAMY, Jay
    Santa Clara, California 95054 (US)
  • ZUNIGA, Steven M.
    Santa Clara, California 95054 (US)

(74) Representative: Zimmermann & Partner Patentanwälte mbB 
Postfach 330 920
80069 München
80069 München (DE)

   


(54) HIGH THROUGHPUT POLISHING MODULES AND MODULAR POLISHING SYSTEMS