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(11)

EP 4 378 244 A1

(12)

(43) Date of publication: 05.06.2024 Bulletin 2024/23 (21) Application number: 22758306.9 (22) Date of filing: 14.07.2022

(51) International Patent Classification (IPC):  H04W 72/02(2009.01) H04W 76/15(2018.01) H04L 5/00(2006.01) H04W 72/04(2023.01) H04W 76/34(2018.01) H04W 56/00(2009.01) (52) Cooperative Patent Classification (CPC): H04W 72/02; H04W 72/0453; H04W 76/15; H04L 5/001; H04L 5/0098; H04W 76/34; H04W 52/16; H04W 52/34; H04L 5/0035; H04L 5/0092; H04W 72/542 (86) International application number: PCT/US2022/037150 (87) International publication number: WO 2023/009326 (02.02.2023 Gazette 2023/05)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA ME Designated Validation States: KH MA MD TN (30) Priority: 29.07.2021 US 202117388910 (71) Applicant: Qualcomm Incorporated San Diego, CA 92121-1714 (US)	(72) Inventors: TAKEDA, Kazuki San Diego, CA 92121-1714 (US) GHEORGHIU, Valentin, Alexandru San Diego, CA 92121-1714 (US) (74) Representative: Bardehle Pagenberg Partnerschaft mbB Patentanwälte Rechtsanwälte  Prinzregentenplatz 7 81675 München 81675 München (DE)