(19)

(11)

EP 4 393 092 A1

(12)

(43) Date of publication: 03.07.2024 Bulletin 2024/27 (21) Application number: 22786567.2 (22) Date of filing: 18.08.2022

(51) International Patent Classification (IPC):  H04L 1/00(2006.01) (52) Cooperative Patent Classification (CPC): H04L 1/0003; H04L 1/0009; H04L 1/0016; H04L 1/0025 (86) International application number: PCT/US2022/040741 (87) International publication number: WO 2023/027936 (02.03.2023 Gazette 2023/09)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA ME Designated Validation States: KH MA MD TN (30) Priority: 27.08.2021 US 202117459900 (71) Applicant: QUALCOMM INCORPORATED San Diego, California 92121-1714 (US)	(72) Inventors: ELSHAFIE, Ahmed San Diego, California 92121-1714 (US) ABDELGHAFFAR, Muhammad Sayed Khairy San Diego, California 92121-1714 (US) MUKKAVILLI, Krishna Kiran San Diego, California 92121-1714 (US) (74) Representative: Bardehle Pagenberg Partnerschaft mbB Patentanwälte Rechtsanwälte  Prinzregentenplatz 7 81675 München 81675 München (DE)