(19)
(11) EP 4 396 859 A1

(12)

(43) Date of publication:
10.07.2024 Bulletin 2024/28

(21) Application number: 22865717.7

(22) Date of filing: 30.08.2022
(51) International Patent Classification (IPC): 
H01L(2006.01)
(52) Cooperative Patent Classification (CPC):
H10B 43/50; H10B 41/50
(86) International application number:
PCT/US2022/075623
(87) International publication number:
WO 2023/034768 (09.03.2023 Gazette 2023/10)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(30) Priority: 30.08.2021 US 202163238426 P

(71) Applicant: Micron Technology, Inc.
Boise, Idaho 83707-0006 (US)

(72) Inventors:
  • ZHAO, Bo
    Boise, Idaho 83709 (US)
  • KING, Matthew, J.
    Boise, Idaho 83713 (US)
  • REECE, Jason
    Boise, Idaho 83716 (US)
  • GOSSMAN, Michael, J.
    Meridian, Idaho 83646 (US)
  • VADIVEL, Shruthi Kumara
    Boise, Idaho 83706 (US)
  • BARCLAY, Martin, J.
    Middleton, Idaho 83644 (US)
  • XU, Lifang
    Boise, Idaho 83716 (US)
  • PETERSON, Joel, D.
    Boise, Idaho 83702 (US)
  • PARK, Matthew
    Boise, Idaho 83709 (US)
  • OLSON, Adam, L.
    Boise, Idaho 83716 (US)
  • KEWLEY, David, A.
    Boise, Idaho 83709 (US)
  • ZHANG, Xiaosong
    Boise, Idaho 83716 (US)
  • DORHOUT, Justin, B.
    Boise, Idaho 83707 (US)
  • YOW, Zhen Feng
    Woodlands Drive 50, 09-305 Singapore 732890 (SG)
  • CHOOI, Kah Sing
    Singapore 560638 (SG)
  • TRAN, Tien Minh Quan
    Singapore 768065 (SG)
  • ONG, Biow Hiem
    Singapore 570442 (SG)

(74) Representative: Marks & Clerk LLP 
15 Fetter Lane
London EC4A 1BW
London EC4A 1BW (GB)

   


(54) MICROELECTRONIC DEVICES INCLUDING STAIR STEP STRUCTURES, AND RELATED ELECTRONIC SYSTEMS AND METHODS