(19)

(11)

EP 4 406 017 A1

(12)

(43) Date of publication: 31.07.2024 Bulletin 2024/31 (21) Application number: 22873354.9 (22) Date of filing: 20.07.2022

(51) International Patent Classification (IPC):  H01L 23/498(2006.01) H01L 23/00(2006.01) H01L 23/14(2006.01) H01L 23/15(2006.01) H01L 21/48(2006.01) (52) Cooperative Patent Classification (CPC): H01L 23/5385; H01L 23/49816; H01L 23/49827; H01L 23/15; H01L 25/0655; H01L 24/16; H01L 24/17 (86) International application number: PCT/US2022/037742 (87) International publication number: WO 2023/048804 (30.03.2023 Gazette 2023/13)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA ME Designated Validation States: KH MA MD TN (30) Priority: 23.09.2021 US 202117482830 (71) Applicant: Intel Corporation Santa Clara, CA 95054 (US)	(72) Inventors: ECTON, Jeremy, D. Gilbert, AZ 85298 (US) PIETAMBARAM, Srinivas, V. Chandler, AZ 85249 (US) MARIN, Brandon, C. Gilbert, AZ 85234 (US) CHEN, Haobo Gilbert, AZ 85295 (US) ARANA, Leonel Phoenix, AZ 85048 (US) (74) Representative: HGF  HGF Limited 1 City Walk Leeds LS11 9DX Leeds LS11 9DX (GB)