(19)
(11) EP 4 406 133 A1

(12)

(43) Date of publication:
31.07.2024 Bulletin 2024/31

(21) Application number: 22777870.1

(22) Date of filing: 23.08.2022
(51) International Patent Classification (IPC): 
H04B 1/40(2015.01)
(52) Cooperative Patent Classification (CPC):
G01R 31/50; H04B 1/40; G01R 31/2837; G01R 31/2822; G06F 11/0754; G06F 11/2038; G06F 11/3058; G06F 11/2028
(86) International application number:
PCT/US2022/075343
(87) International publication number:
WO 2023/049586 (30.03.2023 Gazette 2023/13)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(30) Priority: 24.09.2021 US 202117485092

(71) Applicant: QUALCOMM INCORPORATED
San Diego, California 92121-1714 (US)

(72) Inventors:
  • TSENG, Yi-Hung
    San Diego, California 92121-1714 (US)
  • PEDRALI-NOY, Marzio
    San Diego, California 92121-1714 (US)
  • PERSICO, Charles James
    San Diego, California 92121-1714 (US)
  • KESKIN, Mustafa
    San Diego, California 92121-1714 (US)

(74) Representative: Wimmer, Hubert 
Wagner & Geyer Partnerschaft mbB Patent- und Rechtsanwälte Gewürzmühlstrasse 5
80538 München
80538 München (DE)

   


(54) ROBUST CIRCUITRY FOR PASSIVE FUNDAMENTAL COMPONENTS