(19)

(11)

EP 4 406 200 A1

(12)

(43) Date of publication: 31.07.2024 Bulletin 2024/31 (21) Application number: 22873632.8 (22) Date of filing: 23.09.2022

(51) International Patent Classification (IPC):  H04L 41/0823(2022.01) H04W 36/24(2009.01) H04W 24/04(2009.01) H04L 47/125(2022.01) H04L 43/0876(2022.01) H04W 28/08(2023.01) (52) Cooperative Patent Classification (CPC): H04L 43/0876; H04W 28/08; H04L 41/0823; H04W 24/04; H04L 41/145; H04L 41/16; H04L 41/0806; H04L 41/082; H04W 24/02; H04W 36/22; H04W 36/249 (86) International application number: PCT/US2022/044536 (87) International publication number: WO 2023/049345 (30.03.2023 Gazette 2023/13)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA ME Designated Validation States: KH MA MD TN (30) Priority: 24.09.2021 US 202163248299 P (71) Applicant: INTEL Corporation Santa Clara, CA 95054 (US)	(72) Inventors: CHOU, Joey Scottsdale, Arizona 85258 (US) YAO, Yizhi Chandler, Arizona 85248 (US) (74) Representative: Viering, Jentschura & Partner mbB Patent- und Rechtsanwälte  Am Brauhaus 8 01099 Dresden 01099 Dresden (DE)