(19)
(11) EP 4 406 380 A1

(12)

(43) Date of publication:
31.07.2024 Bulletin 2024/31

(21) Application number: 22873497.6

(22) Date of filing: 21.09.2022
(51) International Patent Classification (IPC): 
H10B 43/30(2023.01)
H10B 43/50(2023.01)
H01L 23/367(2006.01)
H04L 27/26(2006.01)
H10B 43/40(2023.01)
H01L 23/528(2006.01)
H04L 25/02(2006.01)
G06N 3/08(2023.01)
(52) Cooperative Patent Classification (CPC):
H10B 43/30; H10B 43/40; H10B 43/50; H01L 23/3732; H01L 23/36; H04L 27/2601; G06N 3/065; H01L 23/5286; H01L 23/481; H01L 23/473
(86) International application number:
PCT/US2022/044165
(87) International publication number:
WO 2023/049132 (30.03.2023 Gazette 2023/13)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(30) Priority: 21.09.2021 US 202163246658 P
13.10.2021 US 202163255009 P
30.10.2021 US 202163273932 P
13.01.2022 US 202263299011 P
18.01.2022 US 202263300556 P
08.02.2022 US 202263308053 P
18.03.2022 US 202263321109 P
05.04.2022 US 202263327750 P
26.04.2022 US 202263335063 P

(71) Applicant: Monolithic 3D Inc.
Klamath Falls, OR 97601 (US)

(72) Inventors:
  • OR-BACH, Zvi
    3445406 Haifa (IL)
  • HAN, Jin-Woo
    San Jose, California 95124 (US)
  • CRONQUIST, Brian
    Klamath Falls, Oregon 97601 (US)

(74) Representative: Soldatini, Andrea et al
Società Italiana Brevetti S.p.A. Corso dei Tintori, 25
50122 Firenze
50122 Firenze (IT)

   


(54) A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH HEAT SPREADER