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(11)

EP 4 409 638 A1

(12)

(43) Date of publication: 07.08.2024 Bulletin 2024/32 (21) Application number: 22783247.4 (22) Date of filing: 09.09.2022

(51) International Patent Classification (IPC):  H01L 27/02(2006.01) H01L 21/822(2006.01) H01L 29/775(2006.01) H01L 27/092(2006.01) H01L 21/8238(2006.01) H01L 27/118(2006.01) H01L 27/06(2006.01) (52) Cooperative Patent Classification (CPC): H01L 27/0207; H01L 27/11807; H01L 29/775; H01L 2027/11874; H01L 2027/11822; H01L 2027/11837; H01L 21/823807; H01L 21/8221; H01L 27/0688; H01L 27/092; B82Y 10/00; H01L 29/0673; H01L 29/42392; H01L 29/78696 (86) International application number: PCT/US2022/076215 (87) International publication number: WO 2023/056167 (06.04.2023 Gazette 2023/14)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA ME Designated Validation States: KH MA MD TN (30) Priority: 29.09.2021 US 202117489316 (71) Applicant: Advanced Micro Devices, Inc. Santa Clara, CA 95054 (US)	(72) Inventor: SCHULTZ, Richard T. Ft. Collins, Colorado 80528 (US) (74) Representative: Hancox, Jonathan Christopher  Venner Shipley LLP Windsor House 6-10 Mount Ephraim Road Tunbridge Wells, Kent TN1 1EE Tunbridge Wells, Kent TN1 1EE (GB)