(19)
(11) EP 4 410 039 A1

(12)

(43) Date of publication:
07.08.2024 Bulletin 2024/32

(21) Application number: 22800046.9

(22) Date of filing: 01.10.2022
(51) International Patent Classification (IPC): 
H04W 74/08(2024.01)
H04W 72/04(2023.01)
H04W 52/00(2009.01)
(52) Cooperative Patent Classification (CPC):
H04W 74/0833
(86) International application number:
PCT/US2022/077446
(87) International publication number:
WO 2023/056477 (06.04.2023 Gazette 2023/14)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
KH MA MD TN

(30) Priority: 01.10.2021 US 202163251535 P
01.10.2021 US 202163251540 P
30.09.2022 US 202217957099

(71) Applicant: QUALCOMM INCORPORATED
San Diego, California 92121-1714 (US)

(72) Inventors:
  • SAKHNINI, Iyab Issam
    San Diego, California 92121-1714 (US)
  • LUO, Tao
    San Diego, California 92121-1714 (US)
  • SUN, Jing
    San Diego, California 92121-1714 (US)
  • ZHANG, Xiaoxia
    San Diego, California 92121-1714 (US)

(74) Representative: Bardehle Pagenberg Partnerschaft mbB Patentanwälte Rechtsanwälte 
Prinzregentenplatz 7
81675 München
81675 München (DE)

   


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