(19)

(11)

EP 4 413 671 A1

(12)

(43) Date of publication: 14.08.2024 Bulletin 2024/33 (21) Application number: 22783237.5 (22) Date of filing: 08.09.2022

(51) International Patent Classification (IPC):  H04B 7/06(2006.01) H04W 24/08(2009.01) H04B 17/309(2015.01) H04B 7/08(2006.01) H04W 52/02(2009.01) (52) Cooperative Patent Classification (CPC): H04B 7/0695; H04B 7/088; H04W 52/0235; H04W 24/10 (86) International application number: PCT/US2022/076121 (87) International publication number: WO 2023/059970 (13.04.2023 Gazette 2023/15)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA ME Designated Validation States: KH MA MD TN (30) Priority: 08.10.2021 US 202163262263 P 07.09.2022 US 202217930297 (71) Applicant: QUALCOMM Incorporated San Diego, CA 92121-1714 (US)	(72) Inventors: HE, Linhai San Diego, California 92121 (US) HUANG, Chu-Hsiang San Diego, California 92121 (US) (74) Representative: Dunlop, Hugh Christopher et al Maucher Jenkins Seventh Floor Offices Artillery House 11-19 Artillery Row London SW1P 1RT London SW1P 1RT (GB)