<?xml version="1.0" encoding="UTF-8"?><!--This XML data has been generated under the supervision of the European Patent Office --><!DOCTYPE ep-patent-document PUBLIC "-//EPO//EP PATENT DOCUMENT 1.7//EN" "ep-patent-document-v1-7.dtd">
<ep-patent-document country="EP" date-publ="20240821" doc-number="4416747" dtd-version="ep-patent-document-v1-7" file="22769198.7" id="EP22769198A1" kind="A1" lang="de" status="n"><SDOBI lang="de"><B000><eptags><B001EP>ATBECHDEDKESFRGBGRITLILUNLSEMCPTIESILTLVFIROMKCYALTRBGCZEEHUPLSKBAHRIS..MTNORSMESMMAKHTNMD..........</B001EP><B003EP>*</B003EP><B005EP>X</B005EP><B007EP>0009010-RPUB02</B007EP></eptags></B000><B100><B110>4416747</B110><B130>A1</B130><B140><date>20240821</date></B140><B190>EP</B190></B100><B200><B210>22769198.7</B210><B220><date>20220825</date></B220><B240><B241><date>20240513</date></B241></B240><B250>de</B250><B251EP>de</B251EP><B260>de</B260></B200><B300><B310>102021211521</B310><B320><date>20211013</date></B320><B330><ctry>DE</ctry></B330></B300><B400><B405><date>20240821</date><bnum>202434</bnum></B405><B430><date>20240821</date><bnum>202434</bnum></B430></B400><B500><B510EP><classification-ipcr sequence="1"><text>H01F  27/29        20060101AFI20230503BHEP        </text></classification-ipcr><classification-ipcr sequence="2"><text>H05K   3/30        20060101ALI20230503BHEP        </text></classification-ipcr><classification-ipcr sequence="3"><text>H05K   3/34        20060101ALI20230503BHEP        </text></classification-ipcr></B510EP><B520EP><classifications-cpc><classification-cpc sequence="1"><text>H01F  27/292       20130101 FI20221202BHEP        </text></classification-cpc><classification-cpc sequence="2"><text>H01F2005/046       20130101 LA20221205BHEP        </text></classification-cpc><classification-cpc sequence="3"><text>H01F2027/065       20130101 LA20221205BHEP        </text></classification-cpc><classification-cpc sequence="4"><text>H05K2201/1003      20130101 LA20230801BHEP        </text></classification-cpc><classification-cpc sequence="5"><text>H05K   3/3426      20130101 LA20230801BHEP        </text></classification-cpc></classifications-cpc></B520EP><B540><B541>de</B541><B542>VERFAHREN ZUM AUSRICHTEN VON KONTAKTFLÄCHEN EINES ELEKTRISCHEN UND/ODER ELEKTRONISCHEN BAUELEMENTS, INSBESONDERE EINES MAGNETISCHEN BAUELEMENTS</B542><B541>en</B541><B542>METHOD FOR ALIGNING CONTACT SURFACES OF AN ELECTRICAL AND/OR ELECTRONIC COMPONENT, IN PARTICULAR OF A MAGNETIC COMPONENT</B542><B541>fr</B541><B542>PROCÉDÉ D'ALIGNEMENT DE SURFACES DE CONTACT DE COMPOSANT ÉLECTRIQUE ET/OU ÉLECTRONIQUE, EN PARTICULIER DE COMPOSANT MAGNÉTIQUE</B542></B540></B500><B700><B710><B711><snm>Robert Bosch GmbH</snm><iid>101854701</iid><irf>394297</irf><adr><str>Postfach 30 02 20</str><city>70442 Stuttgart</city><ctry>DE</ctry></adr></B711></B710><B720><B721><snm>KAPOOR, Jivan</snm><adr><city>70199 Stuttgart</city><ctry>DE</ctry></adr></B721></B720></B700><B800><B840><ctry>AL</ctry><ctry>AT</ctry><ctry>BE</ctry><ctry>BG</ctry><ctry>CH</ctry><ctry>CY</ctry><ctry>CZ</ctry><ctry>DE</ctry><ctry>DK</ctry><ctry>EE</ctry><ctry>ES</ctry><ctry>FI</ctry><ctry>FR</ctry><ctry>GB</ctry><ctry>GR</ctry><ctry>HR</ctry><ctry>HU</ctry><ctry>IE</ctry><ctry>IS</ctry><ctry>IT</ctry><ctry>LI</ctry><ctry>LT</ctry><ctry>LU</ctry><ctry>LV</ctry><ctry>MC</ctry><ctry>MK</ctry><ctry>MT</ctry><ctry>NL</ctry><ctry>NO</ctry><ctry>PL</ctry><ctry>PT</ctry><ctry>RO</ctry><ctry>RS</ctry><ctry>SE</ctry><ctry>SI</ctry><ctry>SK</ctry><ctry>SM</ctry><ctry>TR</ctry></B840><B844EP><B845EP><ctry>BA</ctry></B845EP><B845EP><ctry>ME</ctry></B845EP></B844EP><B848EP><B849EP><ctry>KH</ctry></B849EP><B849EP><ctry>MA</ctry></B849EP><B849EP><ctry>MD</ctry></B849EP><B849EP><ctry>TN</ctry></B849EP></B848EP><B860><B861><dnum><anum>EP2022073642</anum></dnum><date>20220825</date></B861><B862>de</B862></B860><B870><B871><dnum><pnum>WO2023061647</pnum></dnum><date>20230420</date><bnum>202316</bnum></B871></B870></B800></SDOBI></ep-patent-document>