(19)

(11)

EP 4 416 877 A1

(12)

(43) Date of publication: 21.08.2024 Bulletin 2024/34 (21) Application number: 22772770.8 (22) Date of filing: 31.08.2022

(51) International Patent Classification (IPC):  H04L 1/00(2006.01) (52) Cooperative Patent Classification (CPC): H04L 1/1822; H04L 1/1829 (86) International application number: PCT/US2022/075733 (87) International publication number: WO 2023/064650 (20.04.2023 Gazette 2023/16)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA ME Designated Validation States: KH MA MD TN (30) Priority: 13.10.2021 US 202163262486 P 19.07.2022 US 202217813507 (71) Applicant: QUALCOMM INCORPORATED San Diego, California 92121-1714 (US)	(72) Inventors: KHOSHNEVISAN, Mostafa San Diego, California 92121 (US) ZHANG, Xiaoxia San Diego, California 92121 (US) (74) Representative: Bardehle Pagenberg Partnerschaft mbB Patentanwälte Rechtsanwälte  Prinzregentenplatz 7 81675 München 81675 München (DE)