(19)

(11)

EP 4 420 458 A1

(12)

(43) Date of publication: 28.08.2024 Bulletin 2024/35 (21) Application number: 22884444.5 (22) Date of filing: 20.10.2022

(51) International Patent Classification (IPC):  H04W 72/12(2023.01) H04W 76/27(2018.01) H04W 80/02(2009.01) H04W 72/23(2023.01) H04W 28/02(2009.01) (52) Cooperative Patent Classification (CPC): H04W 80/02; H04W 76/27; H04W 88/085; H04W 76/20; H04W 48/20; H04W 28/0205 (86) International application number: PCT/US2022/047201 (87) International publication number: WO 2023/069568 (27.04.2023 Gazette 2023/17)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: KH MA MD TN (30) Priority: 21.10.2021 US 202163270363 P 21.10.2021 US 202163270426 P (71) Applicant: INTEL Corporation Santa Clara, CA 95054 (US)	(72) Inventors: HAN, Jaemin Portland, Oregon 97229 (US) TARRADELL, Marta Martinez Hillsboro, Oregon 97124 (US) HEO, Youn Hyoung Seoul 150-705 (KR) ALI, Ansab Hillsboro, Oregon 97124 (US) PALAT, Sudeep Cheltenham, Gloucestershire GL51 0GG (GB) (74) Representative: HGF  HGF Limited 1 City Walk Leeds LS11 9DX Leeds LS11 9DX (GB)