(19)
(11) EP 4 422 850 A1

(12)

(43) Date of publication:
04.09.2024 Bulletin 2024/36

(21) Application number: 21964957.1

(22) Date of filing: 22.11.2021
(51) International Patent Classification (IPC): 
B29C 64/112(2017.01)
H05K 3/12(2006.01)
H01P 3/06(2006.01)
B33Y 80/00(2015.01)
B29C 64/106(2017.01)
H05K 3/46(2006.01)
B33Y 10/00(2015.01)
(52) Cooperative Patent Classification (CPC):
B29C 64/112; B33Y 10/00; B29C 64/194; B22F 10/10; H05K 2203/013; H05K 3/4664
(86) International application number:
PCT/US2021/060241
(87) International publication number:
WO 2023/091146 (25.05.2023 Gazette 2023/21)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(71) Applicant: Nano-Dimension Technologies, Ltd.
74036 Nes Ziona (IL)

(72) Inventor:
  • YAMADA, Minoru
    Kowloon, 999077 (HK)

(74) Representative: Fezzardi, Antonio et al
Studio Ferrario Srl Via Collina, 36
00187 Roma
00187 Roma (IT)

   


(54) RF AND MMWAVE CIRCUITS AND THEIR FABRICATION METHODS