(19)
(11)
EP 4 422 850 A1
(12)
(43)
Date of publication:
04.09.2024
Bulletin 2024/36
(21)
Application number:
21964957.1
(22)
Date of filing:
22.11.2021
(51)
International Patent Classification (IPC):
B29C
64/112
(2017.01)
H05K
3/12
(2006.01)
H01P
3/06
(2006.01)
B33Y
80/00
(2015.01)
B29C
64/106
(2017.01)
H05K
3/46
(2006.01)
B33Y
10/00
(2015.01)
(52)
Cooperative Patent Classification (CPC):
B29C
64/112
;
B33Y
10/00
;
B29C
64/194
;
B22F
10/10
;
H05K
2203/013
;
H05K
3/4664
(86)
International application number:
PCT/US2021/060241
(87)
International publication number:
WO 2023/091146
(
25.05.2023
Gazette 2023/21)
(84)
Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN
(71)
Applicant:
Nano-Dimension Technologies, Ltd.
74036 Nes Ziona (IL)
(72)
Inventor:
YAMADA, Minoru
Kowloon, 999077 (HK)
(74)
Representative:
Fezzardi, Antonio et al
Studio Ferrario Srl Via Collina, 36
00187 Roma
00187 Roma (IT)
(54)
RF AND MMWAVE CIRCUITS AND THEIR FABRICATION METHODS