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EP 4 427 068 A1

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(43) Date of publication: 11.09.2024 Bulletin 2024/37 (21) Application number: 22805894.7 (22) Date of filing: 26.10.2022

(51) International Patent Classification (IPC):  G01S 7/493(2006.01) G01S 17/894(2020.01) G01S 17/36(2006.01) G06T 5/00(2024.01) (52) Cooperative Patent Classification (CPC): G01S 7/493; G01S 17/894; G01S 17/36; G06T 7/0002; G06T 2207/10028; G06T 2207/30168 (86) International application number: PCT/EP2022/079911 (87) International publication number: WO 2023/078753 (11.05.2023 Gazette 2023/19)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: KH MA MD TN (30) Priority: 03.11.2021 EP 21206142 (71) Applicants: Sony Semiconductor Solutions Corporation Atsugi-shi, Kanagawa 243-0014 (JP) Sony Depthsensing Solutions SA/NV 1160 Auderghem (Brussels) (BE) AL

(72) Inventor: KENJO, Yukinao 70327 Stuttgart (DE) (74) Representative: MFG Patentanwälte Meyer-Wildhagen Meggle-Freund Gerhard PartG mbB  Amalienstraße 62 80799 München 80799 München (DE)