(19)
(11) EP 4 430 779 A1

(12)

(43) Date of publication:
18.09.2024 Bulletin 2024/38

(21) Application number: 22789803.8

(22) Date of filing: 16.09.2022
(51) International Patent Classification (IPC): 
H04L 1/18(2023.01)
H04L 5/00(2006.01)
(52) Cooperative Patent Classification (CPC):
H04L 1/1861; H04L 1/1896; H04L 1/1854; H04L 5/0055; H04L 5/0094; H04L 5/0048; H04L 5/0051; H04L 27/2601
(86) International application number:
PCT/US2022/076569
(87) International publication number:
WO 2023/086699 (19.05.2023 Gazette 2023/20)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(30) Priority: 10.11.2021 US 202163278032 P
15.09.2022 US 202217932568

(71) Applicant: QUALCOMM INCORPORATED
San Diego, California 92121-1714 (US)

(72) Inventors:
  • HUANG, Yi
    San Diego, California 92121-1714 (US)
  • DIMOU, Konstantinos
    San Diego, California 92121-1714 (US)
  • GAAL, Peter
    San Diego, California 92121-1714 (US)
  • HOSSEINI, Seyedkianoush
    San Diego, California 92121-1714 (US)

(74) Representative: Bardehle Pagenberg Partnerschaft mbB Patentanwälte Rechtsanwälte 
Prinzregentenplatz 7
81675 München
81675 München (DE)

   


(54) DEFERRAL OF SPS HARQ-ACK WITH DIFFERENT PRIORITIES