(19)

(11)

EP 4 430 786 A1

(12)

(43) Date of publication: 18.09.2024 Bulletin 2024/38 (21) Application number: 22789389.8 (22) Date of filing: 20.09.2022

(51) International Patent Classification (IPC):  H04L 5/00(2006.01) H04L 1/18(2023.01) (52) Cooperative Patent Classification (CPC): H04L 5/0055; H04L 1/1896; H04L 1/1861; H04L 5/0094; H04L 5/001 (86) International application number: PCT/US2022/044106 (87) International publication number: WO 2023/086160 (19.05.2023 Gazette 2023/20)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA ME Designated Validation States: KH MA MD TN (30) Priority: 11.11.2021 US 202163278402 P 19.09.2022 US 202217947571 (71) Applicant: QUALCOMM INCORPORATED San Diego, California 92121-1714 (US)	(72) Inventors: YANG, Wei San Diego, California 92121-1714 (US) HUANG, Yi San Diego, California 92121-1714 (US) (74) Representative: Dunlop, Hugh Christopher et al Maucher Jenkins Seventh Floor Offices Artillery House 11-19 Artillery Row London SW1P 1RT London SW1P 1RT (GB)