(19)
(11) EP 4 432 368 A8

(12) CORRECTED EUROPEAN PATENT APPLICATION
published in accordance with Art. 153(4) EPC

(15) Correction information:
Corrected version no 1 (W1 A1)

(48) Corrigendum issued on:
30.10.2024 Bulletin 2024/44

(43) Date of publication:
18.09.2024 Bulletin 2024/38

(21) Application number: 22906944.8

(22) Date of filing: 09.09.2022
(51) International Patent Classification (IPC): 
H01L 31/02(2006.01)
 H01L 27/146(2006.01)
(52) Cooperative Patent Classification (CPC):
H01L 31/02; H01L 25/167; H01L 27/14618; H01L 25/50; H01L 31/0203; H01L 21/6835; H01L 2221/68345
(86) International application number:
PCT/JP2022/033940
(87) International publication number:
WO 2023/112409 (22.06.2023 Gazette 2023/25)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(30) Priority: 13.12.2021 JP 2021201464

(71) Applicant: Hamamatsu Photonics K.K.
Hamamatsu-shi, Shizuoka 435-8558 (JP)

(72) Inventors:
  • INOUE Nao
    (deceased) (JP)
  • SHIMAI Shingo
    Hamamatsu-shi, Shizuoka 435-8558 (JP)
  • SUWA Yosuke
    Hamamatsu-shi, Shizuoka 435-8558 (JP)
  • KOMATSU Tatsuhiro
    Hamamatsu-shi, Shizuoka 435-8558 (JP)

(74) Representative: Hoffmann Eitle 
Patent- und Rechtsanwälte PartmbB Arabellastraße 30
81925 München
81925 München (DE)

   


(54) OPTICAL SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING OPTICAL SEMICONDUCTOR PACKAGE


(57) An optical semiconductor package includes a first chip, a second chip, a first resin portion formed to cover a side surface of the first chip, a second resin portion formed to cover a side surface of the second chip, a first terminal provided on a first inner surface of the first chip, a second terminal provided on a second inner surface of the second chip, and a first wiring electrically connected to the first terminal, passing through an inside of the first resin portion, and extending from a first inner surface side to a first outer surface side of the first chip in a facing direction in which the first inner surface and the second inner surface face each other. The second chip is an optical element having a light receiving portion which receives light incident on the second outer surface of the second chip or a light emitting portion which generates light emitted from the second outer surface to an outside. The first resin portion and the second resin portion are integrally provided or continuously provided via another member.