(19)
(11) EP 4 437 568 A1

(12)

(43) Date of publication:
02.10.2024 Bulletin 2024/40

(21) Application number: 22814349.1

(22) Date of filing: 08.11.2022
(51) International Patent Classification (IPC): 
H01B 1/22(2006.01)
C09D 11/101(2014.01)
C09D 11/52(2014.01)
C09D 11/03(2014.01)
C09D 11/102(2014.01)
(52) Cooperative Patent Classification (CPC):
H01B 1/22; C09D 11/52; C09D 11/033; C09D 11/037; C09D 11/10
(86) International application number:
PCT/EP2022/081110
(87) International publication number:
WO 2023/094141 (01.06.2023 Gazette 2023/22)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
KH MA MD TN

(30) Priority: 23.11.2021 EP 21209981

(71) Applicant: Karlsruher Institut für Technologie
76131 Karlsruhe (DE)

(72) Inventors:
  • SUN, Hongye
    76133 Karlsruhe (DE)
  • WILLENBACHER, Norbert
    67292 Kirchheimbolanden (DE)
  • WENZHE, Ge
    76137 Karlsruhe (DE)

   


(54) HIGHLY CONDUCTIVE FILAMENT FOR FUSED DEPOSITION MODELING