(19)
(11)
EP 4 437 568 A1
(12)
(43)
Date of publication:
02.10.2024
Bulletin 2024/40
(21)
Application number:
22814349.1
(22)
Date of filing:
08.11.2022
(51)
International Patent Classification (IPC):
H01B
1/22
(2006.01)
C09D
11/101
(2014.01)
C09D
11/52
(2014.01)
C09D
11/03
(2014.01)
C09D
11/102
(2014.01)
(52)
Cooperative Patent Classification (CPC):
H01B
1/22
;
C09D
11/52
;
C09D
11/033
;
C09D
11/037
;
C09D
11/10
(86)
International application number:
PCT/EP2022/081110
(87)
International publication number:
WO 2023/094141
(
01.06.2023
Gazette 2023/22)
(84)
Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
KH MA MD TN
(30)
Priority:
23.11.2021
EP 21209981
(71)
Applicant:
Karlsruher Institut für Technologie
76131 Karlsruhe (DE)
(72)
Inventors:
SUN, Hongye
76133 Karlsruhe (DE)
WILLENBACHER, Norbert
67292 Kirchheimbolanden (DE)
WENZHE, Ge
76137 Karlsruhe (DE)
(54)
HIGHLY CONDUCTIVE FILAMENT FOR FUSED DEPOSITION MODELING