(19)
(11) EP 4 453 658 A1

(12)

(43) Date of publication:
30.10.2024 Bulletin 2024/44

(21) Application number: 22834979.1

(22) Date of filing: 09.12.2022
(51) International Patent Classification (IPC): 
G03F 7/20(2006.01)
H01J 37/22(2006.01)
G06T 7/00(2017.01)
(52) Cooperative Patent Classification (CPC):
G03F 7/70616; H01J 2237/221; H01J 2237/24592; H01J 2237/226; G03F 7/706839
(86) International application number:
PCT/EP2022/085173
(87) International publication number:
WO 2023/117489 (29.06.2023 Gazette 2023/26)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
KH MA MD TN

(30) Priority: 20.12.2021 US 202163291569 P

(71) Applicant: Carl Zeiss SMT GmbH
73447 Oberkochen (DE)

(72) Inventors:
  • KLOCHKOV, Dmitry
    73525 Schwäbisch Gmünd (DE)
  • NEUMANN, Jens Timo
    73434 Aalen (DE)
  • KORB, Thomas
    73525 Schwäbisch Gmünd (DE)
  • FOCA, Eugen
    73479 Ellwangen (DE)
  • AVISHAI, Amir
    Pleasanton, California 94588 (US)
  • BUXBAUM, Alex
    San Ramon, California 94582 (US)

(74) Representative: Kraus & Lederer PartGmbB 
Thomas-Wimmer-Ring 15
80539 München
80539 München (DE)

   


(54) METHOD OF 3D VOLUME INSPECTION OF SEMICONDUCTOR WAFERS WITH INCREASED THROUGHPUT