(19)
(11) EP 4 453 975 A2

(12)

(88) Date of publication A3:
03.08.2023

(43) Date of publication:
30.10.2024 Bulletin 2024/44

(21) Application number: 22822115.6

(22) Date of filing: 25.11.2022
(51) International Patent Classification (IPC): 
H01G 9/00(2006.01)
H01G 9/048(2006.01)
 H01G 9/045(2006.01)
H01G 9/055(2006.01)
(52) Cooperative Patent Classification (CPC):
H01G 9/055; H01G 9/048; H01G 9/0029; H01G 9/045
(86) International application number:
PCT/EP2022/083274
(87) International publication number:
WO 2023/117299 (29.06.2023 Gazette 2023/26)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
KH MA MD TN

(30) Priority: 23.12.2021 DE 102021134524

(71) Applicant: TDK Electronics AG
81671 München (DE)

(72) Inventors:
  • BACCO, Cristiano
    20096 Pioltello - Milano (IT)
  • KÜZECI, Erkan
    27010 Ceranovia - Pavia (IT)

(74) Representative: Epping - Hermann - Fischer 
Patentanwaltsgesellschaft mbH Schloßschmidstraße 5
80639 München
80639 München (DE)

   


(54) COUPLED ETCHING AND DEPOSITION PROCESS AND CAPACITOR FOIL FORMED BY THE PROCESS