(19)
(11) EP 4 454 007 A1

(12)

(43) Date of publication:
30.10.2024 Bulletin 2024/44

(21) Application number: 22912719.6

(22) Date of filing: 21.12.2022
(51) International Patent Classification (IPC): 
H01L 23/00(2006.01)
H01L 23/48(2006.01)
(52) Cooperative Patent Classification (CPC):
H01L 24/08; H01L 24/80; H01L 2224/80896; H01L 2224/80895
(86) International application number:
PCT/US2022/082186
(87) International publication number:
WO 2023/122697 (29.06.2023 Gazette 2023/26)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
KH MA MD TN

(30) Priority: 23.12.2021 US 202163293300 P

(71) Applicant: Adeia Semiconductor Bonding Technologies Inc.
San Jose, CA 95134 (US)

(72) Inventors:
  • THEIL, Jeremy, Alfred
    San Jose, California 95134 (US)
  • UZOH, Cyprian, Emeka
    San Jose, California 95134 (US)
  • GAO, Guilian
    San Jose, California 95134 (US)

(74) Representative: Murgitroyd & Company 
165-169 Scotland Street
Glasgow G5 8PL
Glasgow G5 8PL (GB)

   


(54) CONTROLLED GRAIN GROWTH FOR BONDING AND BONDED STRUCTURE WITH CONTROLLED GRAIN GROWTH