(19)
(11) EP 4 457 527 A1

(12)

(43) Date of publication:
06.11.2024 Bulletin 2024/45

(21) Application number: 22917209.3

(22) Date of filing: 19.12.2022
(51) International Patent Classification (IPC): 
G01R 31/28(2006.01)
H01L 21/48(2006.01)
H01L 21/56(2006.01)
 G01R 19/165(2006.01)
H01L 21/52(2006.01)
H01L 23/00(2006.01)
(52) Cooperative Patent Classification (CPC):
G01R 15/207; G01R 31/2829; G01R 31/1227; G01R 31/2853
(86) International application number:
PCT/US2022/053337
(87) International publication number:
WO 2023/129411 (06.07.2023 Gazette 2023/27)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
KH MA MD TN

(30) Priority: 30.12.2021 US 202117566607

(71) Applicant: Texas Instruments Incorporated
Dallas, TX 75265 (US)

(72) Inventor:
  • TUNCER, Enis
    Dallas, TX 75214 (US)

(74) Representative: Zeller, Andreas 
Texas Instruments Deutschland GmbH EMEA Patent Department Haggertystraße 1
85356 Freising
85356 Freising (DE)

   


(54) METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE PACKAGE WITH ISOLATION