(19)

(11)

EP 4 460 904 A1

(12)

(43) Date of publication: 13.11.2024 Bulletin 2024/46 (21) Application number: 22847515.8 (22) Date of filing: 21.12.2022

(51) International Patent Classification (IPC):  H04B 7/06(2006.01) H04W 36/00(2009.01) H04B 7/08(2006.01) H04W 52/02(2009.01) (52) Cooperative Patent Classification (CPC): H04B 7/0617; H04B 7/0658; H04B 7/0695; H04B 7/088; H04W 52/0216; H04W 52/0229; H04W 52/028; H04W 24/10; H04W 24/08; H04W 36/0085; H04W 36/085; H04B 7/06964 (86) International application number: PCT/US2022/082145 (87) International publication number: WO 2023/133046 (13.07.2023 Gazette 2023/28)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: KH MA MD TN (30) Priority: 06.01.2022 US 202263266483 P 20.12.2022 US 202218068897 (71) Applicant: QUALCOMM INCORPORATED San Diego, California 92121-1714 (US)	(72) Inventor: HE, Linhai San Diego, California 92121 (US) (74) Representative: Bardehle Pagenberg Partnerschaft mbB Patentanwälte Rechtsanwälte  Prinzregentenplatz 7 81675 München 81675 München (DE)