(19)

(11)

EP 4 463 976 A1

(12)

(43) Date of publication: 20.11.2024 Bulletin 2024/47 (21) Application number: 23796861.5 (22) Date of filing: 27.04.2023

(51) International Patent Classification (IPC):  H04L 5/00(2006.01) H04W 72/23(2023.01) (52) Cooperative Patent Classification (CPC): H04L 5/0094; H04L 5/0048; H04W 52/0235; H04W 52/0245; H04B 7/088; H04L 5/0053; H04L 5/0025; H04L 5/0091 (86) International application number: PCT/KR2023/005804 (87) International publication number: WO 2023/211219 (02.11.2023 Gazette 2023/44)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: KH MA MD TN (30) Priority: 27.04.2022 CN 202210459615 (71) Applicant: SAMSUNG ELECTRONICS CO., LTD. Yeongtong-gu Suwon-si, Gyeonggi-do 16677 (KR)	(72) Inventors: CHEN, Zhe Gyeonggi-do, 16677 (KR) SUN, Feifei Gyeonggi-do, 16677 (KR) YU, Bin Gyeonggi-do, 16677 (KR) (74) Representative: Nederlandsch Octrooibureau  P.O. Box 29720 2502 LS The Hague 2502 LS The Hague (NL)