(19)
(11) EP 4 466 629 A2

(12)

(88) Date of publication A3:
14.09.2023

(43) Date of publication:
27.11.2024 Bulletin 2024/48

(21) Application number: 23743617.5

(22) Date of filing: 11.01.2023
(51) International Patent Classification (IPC): 
G06F 30/392(2020.01)
G06F 30/00(2020.01)
 G06F 30/398(2020.01)
H01L 21/00(2006.01)
(52) Cooperative Patent Classification (CPC):
G06F 30/392; G06F 30/398
(86) International application number:
PCT/US2023/010630
(87) International publication number:
WO 2023/141045 (27.07.2023 Gazette 2023/30)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
KH MA MD TN

(30) Priority: 19.01.2022 US 202263300675 P
22.11.2022 US 202217992897
22.11.2022 US 202217992899
22.11.2022 US 202217992906
22.11.2022 US 202217992907

(71) Applicant: D2S, Inc.
San Jose, CA 95117 (US)

(72) Inventors:
  • ORIORDAN, Donald
    San Jose, CA 95117 (US)
  • FUJIMURA, Akira
    San Jose, CA 95117 (US)
  • JANAC, George
    San Jose, CA 95117 (US)

(74) Representative: Appleyard Lees IP LLP 
15 Clare Road
Halifax HX1 2HY
Halifax HX1 2HY (GB)

   


(54) COMPUTING AND DISPLAYING A PREDICTED OVERLAP SHAPE IN AN IC DESIGN BASED ON PREDICTED MANUFACTURING CONTOURS