(19)
(11) EP 4 470 036 A1

(12)

(43) Date of publication:
04.12.2024 Bulletin 2024/49

(21) Application number: 23706891.1

(22) Date of filing: 23.01.2023
(51) International Patent Classification (IPC): 
H01L 27/02(2006.01)
H01L 29/861(2006.01)
H01L 29/06(2006.01)
(52) Cooperative Patent Classification (CPC):
H01L 27/0255; H01L 29/861; H01L 29/0649; H01L 29/0692
(86) International application number:
PCT/US2023/011316
(87) International publication number:
WO 2023/141315 (27.07.2023 Gazette 2023/30)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
KH MA MD TN

(30) Priority: 24.01.2022 US 202263302409 P
20.12.2022 US 202218068611

(71) Applicant: Texas Instruments Incorporated
Dallas, TX 75265 (US)

(72) Inventors:
  • MYSORE RAJAGOPAL, Krishna, Praveen
    Santa Clara, CA 95051 (US)
  • DI SARRO, James
    Dallas, TX 75243 (US)
  • XIU, Yang
    Dallas, TX 75243 (US)
  • CONCANNON, Ann
    Santa Clara, CA 95051 (US)

(74) Representative: Zeller, Andreas 
Texas Instruments Deutschland GmbH EMEA Patent Department Haggertystraße 1
85356 Freising
85356 Freising (DE)

   


(54) SEMICONDUCTOR PROTECTION DEVICES WITH HIGH AREA EFFICIENCY