(19)

(11)

EP 4 470 279 A1

(12)

(43) Date of publication: 04.12.2024 Bulletin 2024/49 (21) Application number: 23706500.8 (22) Date of filing: 12.01.2023

(51) International Patent Classification (IPC):  H04W 48/18(2009.01) H04W 88/16(2009.01) (52) Cooperative Patent Classification (CPC): H04W 48/18; H04W 88/16; H04W 60/04 (86) International application number: PCT/US2023/060563 (87) International publication number: WO 2023/147223 (03.08.2023 Gazette 2023/31)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: KH MA MD TN (30) Priority: 26.01.2022 US 202263303406 P 11.01.2023 US 202318153290 (71) Applicant: QUALCOMM INCORPORATED San Diego, California 92121-1714 (US)	(72) Inventors: SPEICHER, Sebastian San Diego, California 92121-1714 (US) FACCIN, Stefano San Diego, California 92121-1714 (US) (74) Representative: Bardehle Pagenberg Partnerschaft mbB Patentanwälte Rechtsanwälte  Prinzregentenplatz 7 81675 München 81675 München (DE)