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EP 4 473 709 A1

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(43) Date of publication: 11.12.2024 Bulletin 2024/50 (21) Application number: 23750385.9 (22) Date of filing: 02.02.2023

(51) International Patent Classification (IPC):  H04L 9/40(2022.01) H04L 67/56(2022.01) (52) Cooperative Patent Classification (CPC): H04L 67/51; H04L 41/34; H04L 41/0803 (86) International application number: PCT/US2023/061828 (87) International publication number: WO 2023/150605 (10.08.2023 Gazette 2023/32)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: KH MA MD TN (30) Priority: 02.02.2022 US 202263305787 P (71) Applicant: INTEL Corporation Santa Clara, CA 95054 (US)

(72) Inventors: DING, Zongrui Portland, Oregon 97229 (US) LI, Qian Beaverton, Oregon 97006 (US) TONG, Xiaopeng Beijing 100090 (CN) STOJANOVSKI, Alexandre Saso 75020 Paris 75 (FR) LUETZENKIRCHEN, Thomas 82024 Taufkirchen BY (DE) PALAT, Sudeep Cheltenham Gloucestershire GLS GL51 0GG (GB) LIAO, Ching-Yu Portland, Oregon 97229 (US) KOLEKAR, Abhijeet Portland, Oregon 97229 (US) BANGOLAE, Sangeetha L. Portland, Oregon 97229 (US) HEO, Youn Hyoung San Jose, California 95134 (US) (74) Representative: Viering, Jentschura & Partner mbB Patent- und Rechtsanwälte  Am Brauhaus 8 01099 Dresden 01099 Dresden (DE)