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EP 4 473 760 A1

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(43) Date of publication: 11.12.2024 Bulletin 2024/50 (21) Application number: 23708943.8 (22) Date of filing: 31.01.2023

(51) International Patent Classification (IPC):  H04W 24/02(2009.01) H04W 24/10(2009.01) (52) Cooperative Patent Classification (CPC): H04W 24/02; H04W 8/18; H04W 12/084 (86) International application number: PCT/US2023/012037 (87) International publication number: WO 2023/147189 (03.08.2023 Gazette 2023/31)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: KH MA MD TN (30) Priority: 31.01.2022 US 202263267387 P 30.01.2023 US 202318161507 (71) Applicant: QUALCOMM INCORPORATED San Diego, California 92121-1714 (US)

(72) Inventors: KUMAR, Rajeev San Diego, California 92121 (US) AWONIYI-OTERI, Olufunmilola Omolade San Diego, California 92121 (US) HORN, Gavin Bernard San Diego, California 92121 (US) GHOLMIEH, Aziz San Diego, California 92121 (US) LEE, Soo Bum San Diego, California 92121 (US) ZORGUI, Marwen San Diego, California 92121 (US) KIM, Hongil San Diego, California 92121 (US) (74) Representative: Reddie & Grose LLP  The White Chapel Building 10 Whitechapel High Street London E1 8QS London E1 8QS (GB)