(19)

(11)

EP 4 473 766 A1

(12)

(43) Date of publication: 11.12.2024 Bulletin 2024/50 (21) Application number: 23709543.5 (22) Date of filing: 01.02.2023

(51) International Patent Classification (IPC):  H04W 40/02(2009.01) (52) Cooperative Patent Classification (CPC): H04W 40/02 (86) International application number: PCT/US2023/061760 (87) International publication number: WO 2023/150558 (10.08.2023 Gazette 2023/32)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: KH MA MD TN (30) Priority: 03.02.2022 US 202263267516 P 31.01.2023 US 202318162000 (71) Applicant: QUALCOMM INCORPORATED San Diego, California 92121-1714 (US)	(72) Inventors: PALADUGU, Karthika San Diego, California 92121 (US) CHENG, Hong San Diego, California 92121 (US) (74) Representative: Dunlop, Hugh Christopher et al Maucher Jenkins Seventh Floor Offices Artillery House 11-19 Artillery Row London SW1P 1RT London SW1P 1RT (GB)