(19)
(11) EP 4 475 750 A1

(12)

(43) Date of publication:
18.12.2024 Bulletin 2024/51

(21) Application number: 22931188.1

(22) Date of filing: 10.03.2022
(51) International Patent Classification (IPC): 
A61B 5/0507(2021.01)
A61B 5/00(2006.01)
(52) Cooperative Patent Classification (CPC):
A61B 5/0507; A61B 5/4547; A61B 5/4552
(86) International application number:
PCT/US2022/019855
(87) International publication number:
WO 2023/172265 (14.09.2023 Gazette 2023/37)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(71) Applicant: National Tsing Hua University
Hsinchu City 300 (TW)

(72) Inventors:
  • WANG, Wei-Chih
    Sammamish, WA 98074 (US)
  • MUTHURAMALINGAM, Karthikraj
    Hsinchu City, 300 (TW)
  • WANG, Fiona, Marie
    Seattle, WA 98195 (US)

(74) Representative: Manitz Finsterwald Patent- und Rechtsanwaltspartnerschaft mbB 
Martin-Greif-Strasse 1
80336 München
80336 München (DE)

   


(54) SCANNING BASED THZ NEARFIELD IMAGING DEVICE