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EP 4 476 642 A1

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(43) Date of publication: 18.12.2024 Bulletin 2024/51 (21) Application number: 23708107.0 (22) Date of filing: 26.01.2023

(51) International Patent Classification (IPC):  G06F 21/44(2013.01) H04L 67/306(2022.01) H04W 12/06(2021.01) H04W 60/02(2009.01) H04L 9/40(2022.01) H04W 8/18(2009.01) H04W 12/72(2021.01) H04W 84/04(2009.01) (52) Cooperative Patent Classification (CPC): H04W 12/06; G06F 21/44; H04L 63/0892; H04L 63/0876; H04L 63/108; G06F 2221/2117; H04L 67/306; H04L 67/51; H04W 12/72; H04W 8/26; H04L 69/28 (86) International application number: PCT/US2023/061373 (87) International publication number: WO 2023/154628 (17.08.2023 Gazette 2023/33)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: KH MA MD TN (30) Priority: 08.02.2022 IN 202221006637 13.01.2023 US 202318154698 (71) Applicant: Qualcomm Incorporated San Diego, CA 92121-1714 (US)

(72) Inventors: GUPTA, Nishant San Diego, California 92121 (US) KIM, Sunghoon San Diego, California 92121 (US) SOLOWAY, Alan San Diego, California 92121 (US) TONESI, Dario Serafino San Diego, California 92121 (US) CHIN, Tom San Diego, California 92121 (US) PAYYAPPILLY, Ajith Tom San Diego, California 92121 (US) (74) Representative: Bardehle Pagenberg Partnerschaft mbB Patentanwälte Rechtsanwälte  Prinzregentenplatz 7 81675 München 81675 München (DE)