(19)
(11) EP 4 480 261 A1

(12)

(43) Date of publication:
25.12.2024 Bulletin 2024/52

(21) Application number: 23706228.6

(22) Date of filing: 18.01.2023
(51) International Patent Classification (IPC): 
H04W 72/40(2023.01)
H04W 8/24(2009.01)
H04W 72/25(2023.01)
(52) Cooperative Patent Classification (CPC):
H04W 72/40; H04W 72/25; H04W 8/24; H04W 48/12
(86) International application number:
PCT/US2023/060829
(87) International publication number:
WO 2023/154608 (17.08.2023 Gazette 2023/33)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
KH MA MD TN

(30) Priority: 14.02.2022 US 202263267972 P
07.12.2022 US 202218062919

(71) Applicant: QUALCOMM INCORPORATED
San Diego, California 92121-1714 (US)

(72) Inventors:
  • LI, Qing
    San Diego, California 92121 (US)
  • LI, Junyi
    San Diego, California 92121 (US)
  • CHENG, Hong
    San Diego, California 92121 (US)

(74) Representative: Bardehle Pagenberg Partnerschaft mbB Patentanwälte Rechtsanwälte 
Prinzregentenplatz 7
81675 München
81675 München (DE)

   


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