(19)

(11)

EP 4 480 267 A1

(12)

(43) Date of publication: 25.12.2024 Bulletin 2024/52 (21) Application number: 23714619.6 (22) Date of filing: 17.02.2023

(51) International Patent Classification (IPC):  H04W 74/08(2024.01) H04W 36/00(2009.01) (52) Cooperative Patent Classification (CPC): H04W 74/0833; H04W 36/06 (86) International application number: PCT/US2023/062797 (87) International publication number: WO 2023/159167 (24.08.2023 Gazette 2023/34)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: KH MA MD TN (30) Priority: 20.02.2022 US 202263312062 P 16.02.2023 US 202318170051 (71) Applicant: QUALCOMM INCORPORATED San Diego, California 92121-1714 (US)	(72) Inventors: SHARMA, Prashant San Diego, California 92121-1714 (US) ISLAM, Muhammad Nazmul San Diego, California 92121-1714 (US) HSU, Chun-Hao San Diego, California 92121-1714 (US) WU, Yongle San Diego, California 92121-1714 (US) (74) Representative: Dunlop, Hugh Christopher  Maucher Jenkins Seventh Floor Offices Artillery House 11-19 Artillery Row London SW1P 1RT London SW1P 1RT (GB)