(19)
(11) EP 4 483 012 A2

(12)

(88) Date of publication A3:
05.10.2023

(43) Date of publication:
01.01.2025 Bulletin 2025/01

(21) Application number: 23760540.7

(22) Date of filing: 15.02.2023
(51) International Patent Classification (IPC): 
D21J 3/00(2006.01)
C08L 1/02(2006.01)
D21H 27/10(2006.01)
D21H 19/34(2006.01)
B65D 1/00(2006.01)
D21H 19/52(2006.01)
D21J 1/08(2006.01)
(52) Cooperative Patent Classification (CPC):
D21J 3/00; D21H 11/18
(86) International application number:
PCT/US2023/013169
(87) International publication number:
WO 2023/163888 (31.08.2023 Gazette 2023/35)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
KH MA MD TN

(30) Priority: 22.02.2022 US 202263312659 P

(71) Applicant: Purdue Research Foundation
West Lafayette, IN 47906 (US)

(72) Inventors:
  • YOUNGBLOOD, Jeffrey
    Lafayette, IN 47906 (US)
  • FORTI, Endrina
    Lafayette, IN 47906 (US)
  • ZHANG, Jiangxuan
    Lafayette, IN 47906 (US)

(74) Representative: Pritzlaff, Stefanie Lydia 
Wagner & Geyer Partnerschaft mbB Patent- und Rechtsanwälte Gewürzmühlstraße 5
80538 München
80538 München (DE)

   


(54) METHOD AND APPARATUS FOR MOLDING OF CNF-CMC ONTO MOLDED PULP