(19)
(11) EP 4 483 515 A2

(12)

(88) Date of publication A3:
12.10.2023

(43) Date of publication:
01.01.2025 Bulletin 2025/01

(21) Application number: 23714431.6

(22) Date of filing: 24.02.2023
(51) International Patent Classification (IPC): 
H04L 1/1829(2023.01)
(52) Cooperative Patent Classification (CPC):
H04L 1/1861
(86) International application number:
PCT/US2023/063241
(87) International publication number:
WO 2023/164626 (31.08.2023 Gazette 2023/35)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
KH MA MD TN

(30) Priority: 25.02.2022 US 202263314264 P
23.02.2023 US 202318173713

(71) Applicant: QUALCOMM INCORPORATED
San Diego, California 92121-1714 (US)

(72) Inventors:
  • YANG, Wei
    San Diego, California 92121-1714 (US)
  • HUANG, Yi
    San Diego, California 92121-1714 (US)

(74) Representative: Dunlop, Hugh Christopher et al
Maucher Jenkins Seventh Floor Offices Artillery House 11-19 Artillery Row
London SW1P 1RT
London SW1P 1RT (GB)

   


(54) HARQ-ACK FEEDBACK AND INTRA-UE MULTIPLEXING