ANTENNA MODULE AND ELECTRONIC DEVICE COMPRISING SAME

Abstract

 Various embodiments of the present disclosure relate to an antenna and an electronic device comprising same. The electronic device comprises: a housing comprising a front cover, a rear cover facing in the opposite direction to the front cover, and a lateral member surrounding the space between the front cover and the rear cover and comprising an at least partially conductive part; and an antenna assembly positioned in the space. The antenna assembly further comprises: an antenna circuit board; an antenna array disposed on one surface of the antenna circuit board and formed to transmit and/or receive signals in a first direction toward the rear cover; a wireless communication circuit electrically connected to the antenna array and configured to transmit and/or receive radio frequency (RF) signals; an antenna bracket comprising a first surface facing one surface of the antenna array and a second surface which abuts one end of the first surface, and which is perpendicular to the first surface, the antenna bracket supporting the antenna array; and a support member abutting the second surface of the antenna bracket and corresponding to at least a part of the lateral member of the housing.

Description

[Technical Field]

[0001] Various embodiments of the disclosure relate to an antenna module and an electronic device including the antenna module.

[Background Art]

[0002] Electronic devices may output information stored therein as sound or an image. As the integration degree of electronic devices increases and ultra-high-speed and high-capacity wireless communication become more widespread, a single electronic device such as a mobile communication terminal may now be equipped with various functions.. For example, not only communication functions, but also entertainment functions such as games, multimedia functions such as music/video playback, communication and security functions for mobile banking and other similar services, schedule management functions, and electronic wallet functions are being integrated into a single electronic device.

[0003] In communication devices embedded in electronic devices, efforts are being made to develop a next-generation communication system, such as a next-generation (e.g., 5th-generation) communication system or a pre-next-generation communication system, in order to meet the increasing demand for wireless data traffic following the commercialization of 4G (4th-generation) communication systems.

[0004] In order to achieve high data transmission rates, a next generation communication system is being implemented in the ultra-high-frequency band (tens of GHz bands, for example, bands of 6 GHz or more and 300 GHz or less), such as millimeter waves (mmWave). In order to mitigate path loss of radio waves and increase the transmission distance of radio waves in the ultra-high-frequency band, beamforming, massive multi-input multi-output (massive MIMO), full dimensional MIMO (FD-MIMO), antenna array, analog beamforming, and large-scale antenna technologies are being developed in next-generation communication systems.

[Detailed Description of the Invention]

[Technical Problem]

[0005] Transmission and/or reception by an antenna may be implemented by the outer housing of an electronic device, a metal radiator within the electronic device, or a metal trace on a printed circuit board.

[0006] The above-described antenna structure may be an appropriate type when using a frequency band equal to or lower than a predetermined frequency (e.g., 6 GHz or lower), but when using a frequency band equal to or higher than a predetermined frequency (e.g., 6 GHz or higher) with strong directivity, the antenna structure may not be possible to achieve efficient transmission and reception. For example, the antenna structure for using a wavelength in a high-frequency band equal to or higher than a predetermined frequency (e.g., 6 GHz or higher) should be implemented as an antenna module that includes a plurality of dipole antennas, patch antennas, or transceiver circuitry. For efficient transmission and reception, the antenna structure may be disposed to be spaced apart from elements that may interfere with transmission and reception (e.g., a component containing metal, a display, and the like) inside the electronic device.

[0007] According to various embodiments of the disclosure, it is possible to implement an antenna module in an electronic device that transmits and receives signals in a direction different from that of an outer metal housing for efficient transmission and reception, and an antenna housing structure equipped with the antenna module.

[0008] However, the problems that the disclosure seeks to solve are not limited to the aforementioned problems, and may be expanded in various ways without departing from the spirit and scope of the disclosure.

[Technical Solution]

[0009] An antenna according to various embodiments of the disclosure and an electronic device including the same may include a housing including a front surface cover, a rear surface cover facing away from the front surface cover, and a side surface member surrounding a space between the front surface cover and the rear surface cover and at least partially including a conductive portion, and an antenna assembly disposed within the space. The antenna assembly may further include an antenna circuit board, an antenna array disposed on one surface of the antenna circuit board and configured to transmit and/or receive a signal in a first direction toward the rear surface cover, a wireless communication circuit electrically connected to the antenna array and configured to transmit and/or receive a radio frequency (RF) signal, an antenna bracket including a first surface facing the one surface of the antenna array and a second surface in contact with one end of the first surface and perpendicular to the first surface, the antenna bracket being configured to support the antenna array, and a support member in contact with the second surface of the antenna bracket and corresponding to at least a portion of the side surface member of the housing.

[0010] An antenna assembly according to various embodiments of the disclosure may be disposed within a housing that includes a front surface cover, a rear surface cover facing away from the front surface cover, and a side surface member surrounding a space between the front surface cover and the rear surface cover and at least partially including a conductive portion. The antenna assembly may include an antenna circuit board, an antenna array disposed on one surface of the antenna circuit board and configured to transmit and/or receive a signal in a first direction toward the rear surface cover, a wireless communication circuit electrically connected to the antenna array and configured to transmit and/or receive a radio frequency (RF) signal, an antenna bracket including a first surface facing the one surface of the antenna array and a second surface in contact with one end of the first surface and perpendicular to the first surface, the antenna bracket being configured to support the antenna array, and a support member in contact with the second surface of the antenna bracket and corresponding to at least a portion of the side surface member of the housing.

[0011] An electronic device according to various embodiments of the disclosure may include a housing including a front surface cover, a rear surface cover facing away from the front surface cover, and a side surface member surrounding a space between the front surface cover and the rear surface cover and at least partially including a conductive portion, an antenna assembly including an antenna array disposed within the space and configured to transmit and/or receive a signal in a first direction toward the rear cover, and an antenna bracket including a first surface facing one surface of the antenna array, and a second surface in contact with one end of the first surface and perpendicular to the first surface, and configured to support the antenna array, and a support member in contact with the second surface of the antenna bracket and corresponding to at least a portion of the side surface member of the housing.

[Advantageous Effects]

[0012] In the electronic device according to various embodiments of the disclosure, according to an embodiment of the disclosure, since the radiation from a plurality of the antennas is directed to the rear surface rather than being directed to the side surface, the support member disposed in the direction of the side surface may include metal. Therefore, by making the materials of the housing and the support member the same, the appearance of the electronic device may be made beautiful. In addition, by connecting the antenna assembly to the outside, the manufacturing of the antenna assembly and the assembly of the electronic device may be facilitated.

[0013] In the electronic device according to various embodiments of the disclosure, since the first portion of the side surface member of the housing exposed to the outside includes an opening, but the remaining second portion, third portion, and fourth portion have a closed structure in a "

" shape, the area of the housing surrounding the antenna assembly may be increased. In addition, the rigidity of the housing can be ensured.

[0014] In the electronic device according to various embodiments of the disclosure, since the antenna assembly is continuously formed, the length of the side surface member of the housing surrounding the antenna assembly may be reduced. This may influence the mounting length of a battery to be maintained or increased, so that the battery performance may be maintained and/or improved.

[Brief Description of Drawings]

[0015] 

FIG. 1 is a block diagram of an electronic device according to various embodiments of the disclosure in a network environment.

FIG. 2 is a front perspective view illustrating an electronic device according to various embodiments of the disclosure.

FIG. 3 is a rear perspective view illustrating the electronic device according to various embodiments of the disclosure.

FIG. 4 is an exploded perspective view illustrating the electronic device according to various embodiments of the disclosure.

FIGS. 5A to 5D are views illustrating an embodiment of a structure of an electronic device according to various embodiments of the disclosure.

FIG. 6A is a perspective view of the third antenna module as viewed from one side, and FIG. 6B is a perspective view of the third antenna module as viewed from the other side. FIG. 6C is a cross-sectional view of the third antenna module taken along line B-B'.

FIG. 7A is a perspective view illustrating an assembled antenna assembly according to various embodiments of the disclosure.

FIG. 7B is a perspective view illustrating an assembled antenna assembly according to an embodiment of the disclosure.

FIG. 8 is a front view illustrating an antenna assembly coupled to an electronic device 101 according to various embodiments of the disclosure.

FIG. 9 is a cross-sectional view of the antenna assembly in FIG. 8, taken along line A-A'.

FIG. 10 is a cross-sectional view of the antenna assembly in FIG. 8, taken along line B-B' including an FPCB lead-out portion.

FIG. 11 is a perspective view illustrating an assembly process of an antenna assembly according to various embodiments of the disclosure.

FIG. 12 is a perspective view illustrating an antenna assembly disposed in an electronic device to correspond to a first opening included in a side surface member of the housing.

FIG. 13 is a perspective view illustrating an inner antenna assembly according to another embodiment of the disclosure.

FIG. 14 is a perspective view illustrating the inner antenna assembly according to another embodiment of the disclosure disposed in an electronic device to correspond with a first opening included in a side member inside the housing.

[Mode for Carrying out the Invention]

[0016] FIG. 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to an embodiment.

[0017] Referring to FIG. 1, the electronic device 101 in the network environment 100 may communicate with an electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or at least one of an electronic device 104 or a server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connecting terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the components (e.g., the connecting terminal 178) may be omitted from the electronic device 101, or one or more other components may be added in the electronic device 101. In some embodiments, some of the components (e.g., the sensor module 176, the camera module 180, or the antenna module 197) may be implemented as a single component (e.g., the display module 160).

[0018] The processor 120 may execute, for example, software (e.g., a program 140) to control at least one other component (e.g., a hardware or software component) of the electronic device 101 coupled with the processor 120, and may perform various data processing or computation. According to one embodiment, as at least part of the data processing or computation, the processor 120 may store a command or data received from another component (e.g., the sensor module 176 or the communication module 190) in volatile memory 132, process the command or the data stored in the volatile memory 132, and store resulting data in non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)), or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operable independently from, or in conjunction with, the main processor 121. For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or to be specific to a specified function. The auxiliary processor 123 may be implemented as separate from, or as part of the main processor 121.

[0019] The auxiliary processor 123 may control at least some of functions or states related to at least one component (e.g., the display module 160, the sensor module 176, or the communication module 190) among the components of the electronic device 101, instead of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or together with the main processor 121 while the main processor 121 is in an active state (e.g., executing an application). According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., the camera module 180 or the communication module 190) functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., the neural processing unit) may include a hardware structure specified for artificial intelligence model processing. An artificial intelligence model may be generated by machine learning. Such learning may be performed, e.g., by the electronic device 101 where the artificial intelligence is performed or via a separate server (e.g., the server 108). Learning algorithms may include, but are not limited to, e.g., supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include a plurality of artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), deep Q-network or a combination of two or more thereof but is not limited thereto. The artificial intelligence model may, additionally or alternatively, include a software structure other than the hardware structure.

[0020] The memory 130 may store various data used by at least one component (e.g., the processor 120 or the sensor module 176) of the electronic device 101. The various data may include, for example, software (e.g., the program 140) and input data or output data for a command related thereto. The memory 130 may include the volatile memory 132 or the non-volatile memory 134.

[0021] The program 140 may be stored in the memory 130 as software, and may include, for example, an operating system (OS) 142, middleware 144, or an application 146.

[0022] The input module 150 may receive a command or data to be used by another component (e.g., the processor 120) of the electronic device 101, from the outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0023] The sound output module 155 may output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as playing multimedia or playing record. The receiver may be used for receiving incoming calls. According to an embodiment, the receiver may be implemented as separate from, or as part of the speaker.

[0024] The display module 160 may visually provide information to the outside (e.g., a user) of the electronic device 101. The display module 160 may include, for example, a display, a hologram device, or a projector and control circuitry to control a corresponding one of the display, hologram device, and projector. According to an embodiment, the display module 160 may include a touch sensor adapted to detect a touch, or a pressure sensor adapted to measure the intensity of force incurred by the touch.

[0025] The audio module 170 may convert a sound into an electrical signal and vice versa. According to an embodiment, the audio module 170 may obtain the sound via the input module 150, or output the sound via the sound output module 155 or a headphone of an external electronic device (e.g., an electronic device 102) directly (e.g., wiredly) or wirelessly coupled with the electronic device 101.

[0026] The sensor module 176 may detect an operational state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) external to the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0027] The interface 177 may support one or more specified protocols to be used for the electronic device 101 to be coupled with the external electronic device (e.g., the electronic device 102) directly (e.g., wiredly) or wirelessly. According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0028] A connecting terminal 178 may include a connector via which the electronic device 101 may be physically connected with the external electronic device (e.g., the electronic device 102). According to an embodiment, the connecting terminal 178 may include, for example, a HDMI connector, a USB connector, a SD card connector, or an audio connector (e.g., a headphone connector).

[0029] The haptic module 179 may convert an electrical signal into a mechanical stimulus (e.g., a vibration or a movement) or electrical stimulus which may be recognized by a user via his tactile sensation or kinesthetic sensation. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electric stimulator.

[0030] The camera module 180 may capture a still image or moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

[0031] The power management module 188 may manage power supplied to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0032] The battery 189 may supply power to at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a primary cell which is not rechargeable, a secondary cell which is rechargeable, or a fuel cell.

[0033] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and the external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108) and performing communication via the established communication channel. The communication module 190 may include one or more communication processors that are operable independently from the processor 120 (e.g., the application processor (AP)) and supports a direct (e.g., wired) communication or a wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules may communicate with the external electronic device via the first network 198 (e.g., a short-range communication network, such as Bluetooth^™, wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or the second network 199 (e.g., a long-range communication network, such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or wide area network (WAN)). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multi components (e.g., multi chips) separate from each other. The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network, such as the first network 198 or the second network 199, using subscriber information (e.g., international mobile subscriber identity (IMSI)) stored in the subscriber identification module 196.

[0034] The wireless communication module 192 may support a 5G network, after a 4G network, and next-generation communication technology, e.g., new radio (NR) access technology. The NR access technology may support enhanced mobile broadband (eMBB), massive machine type communications (mMTC), or ultra-reliable and low-latency communications (URLLC). The wireless communication module 192 may support a high-frequency band (e.g., the mmWave band) to achieve, e.g., a high data transmission rate. The wireless communication module 192 may support various technologies for securing performance on a high-frequency band, such as, e.g., beamforming, massive multiple-input and multiple-output (massive MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., the electronic device 104), or a network system (e.g., the second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate (e.g., 20Gbps or more) for implementing eMBB, loss coverage (e.g., 164dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5ms or less for each of downlink (DL) and uplink (UL), or a round trip of 1ms or less) for implementing URLLC.

[0035] The antenna module 197 may transmit or receive a signal or power to or from the outside (e.g., the external electronic device) of the electronic device 101. According to an embodiment, the antenna module 197 may include an antenna including a radiating element composed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., array antennas). In such a case, at least one antenna appropriate for a communication scheme used in the communication network, such as the first network 198 or the second network 199, may be selected, for example, by the communication module 190 (e.g., the wireless communication module 192) from the plurality of antennas. The signal or the power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as part of the antenna module 197.

[0036] According to an embodiment, the antenna module 197 may form a mmWave antenna module. According to an embodiment, the mmWave antenna module may include a printed circuit board, a RFIC disposed on a first surface (e.g., the bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a designated high-frequency band (e.g., the mmWave band), and a plurality of antennas (e.g., array antennas) disposed on a second surface (e.g., the top or a side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the designated high-frequency band.

[0037] At least some of the above-described components may be coupled mutually and communicate signals (e.g., commands or data) therebetween via an inter-peripheral communication scheme (e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)).

[0038] According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 via the server 108 coupled with the second network 199. Each of the electronic devices 102 or 104 may be a device of a same type as, or a different type, from the electronic device 101. According to an embodiment, all or some of operations to be executed at the electronic device 101 may be executed at one or more of the external electronic devices 102, 104, or 108. For example, if the electronic device 101 should perform a function or a service automatically, or in response to a request from a user or another device, the electronic device 101, instead of, or in addition to, executing the function or the service, may request the one or more external electronic devices to perform at least part of the function or the service. The one or more external electronic devices receiving the request may perform the at least part of the function or the service requested, or an additional function or an additional service related to the request, and transfer an outcome of the performing to the electronic device 101. The electronic device 101 may provide the outcome, with or without further processing of the outcome, as at least part of a reply to the request. To that end, a cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device 101 may provide ultra low-latency services using, e.g., distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an internet-of-things (IoT) device. The server 108 may be an intelligent server using machine learning and/or a neural network. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology or IoT-related technology.

[0039] The electronic device according to an embodiment may be one of various types of electronic devices. The electronic devices may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to an embodiment of the disclosure, the electronic devices are not limited to those described above.

[0040] It should be appreciated that an embodiment of the present disclosure and the terms used therein are not intended to limit the technological features set forth herein to particular embodiments and include various changes, equivalents, or replacements for a corresponding embodiment. With regard to the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It is to be understood that a singular form of a noun corresponding to an item may include one or more of the things, unless the relevant context clearly indicates otherwise. As used herein, each of such phrases as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C," may include any one of, or all possible combinations of the items enumerated together in a corresponding one of the phrases. As used herein, such terms as "1st" and "2nd," or "first" and "second" may be used to simply distinguish a corresponding component from another, and does not limit the components in other aspect (e.g., importance or order). It is to be understood that if an element (e.g., a first element) is referred to, with or without the term "operatively" or "communicatively", as "coupled with," "coupled to," "connected with," or "connected to" another element (e.g., a second element), it means that the element may be coupled with the other element directly (e.g., wiredly), wirelessly, or via a third element.

[0041] As used in connection with an embodiment of the disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may interchangeably be used with other terms, for example, "logic," "logic block," "part," or "circuitry". A module may be a single integral component, or a minimum unit or part thereof, adapted to perform one or more functions. For example, according to an embodiment, the module may be implemented in a form of an application-specific integrated circuit (ASIC).

[0042] An embodiment as set forth herein may be implemented as software (e.g., the program 140) including one or more instructions that are stored in a storage medium (e.g., internal memory 136 or external memory 138) that is readable by a machine (e.g., the electronic device 101). For example, a processor (e.g., the processor 120) of the machine (e.g., the electronic device 101) may invoke at least one of the one or more instructions stored in the storage medium, and execute it, with or without using one or more other components under the control of the processor. This allows the machine to be operated to perform at least one function according to the at least one instruction invoked. The one or more instructions may include a code generated by a complier or a code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Wherein, the term "non-transitory" simply means that the storage medium is a tangible device, and does not include a signal (e.g., an electromagnetic wave), but this term does not differentiate between where data is semi-permanently stored in the storage medium and where the data is temporarily stored in the storage medium.

[0043] According to an embodiment, a method according to an embodiment of the disclosure may be included and provided in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or be distributed (e.g., downloaded or uploaded) online via an application store (e.g., PlayStore^™), or between two user devices (e.g., smart phones) directly. If distributed online, at least part of the computer program product may be temporarily generated or at least temporarily stored in the machine-readable storage medium, such as memory of the manufacturer's server, a server of the application store, or a relay server.

[0044] According to an embodiment, each component (e.g., a module or a program) of the above-described components may include a single entity or multiple entities, and some of the multiple entities may be separately disposed in different components. According to an embodiment, one or more of the above-described components may be omitted, or one or more other components may be added. Alternatively or additionally, a plurality of components (e.g., modules or programs) may be integrated into a single component. In such a case, according to various embodiments, the integrated component may still perform one or more functions of each of the plurality of components in the same or similar manner as they are performed by a corresponding one of the plurality of components before the integration. According to an embodiment, operations performed by the module, the program, or another component may be carried out sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be executed in a different order or omitted, or one or more other operations may be added.

[0045] FIG. 2 is a front side perspective view illustrating an electronic device 101 according to various embodiments of the disclosure. FIG. 3 is a rear perspective view illustrating the electronic device 101 according to various embodiments of the disclosure.

[0046] Referring to FIGS. 2 and 3, the electronic device 101 according to an embodiment may include a housing 310 including a first surface (or a front surface) 310A, a second surface (or a rear surface) 31 0B, and a side surface 310C surrounding the space between the first surface 310A and the second surface 310B. In another embodiment (not illustrated), the term "housing" may refer to a structure providing part of the first surface 3 10A, the second surface 3 10B, and the side surface 310C of FIG. 2. According to an embodiment, at least a portion of the first surface 310A may be made of a substantially transparent front surface plate 302 (e.g., a glass plate or a polymer plate with various coating layers). The second surface 310B may be made of a substantially opaque rear surface plate 311. The rear surface plate 311 may be made of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of two or more of these materials. The side surface 310C may be defined by a side surface bezel structure (or a "side surface member") 318 coupled to the front surface plate 302 and the rear surface plate 311 and including metal and/or polymer. In some embodiments, the rear surface plate 311 and the side surface bezel structure 318 may be integrally configured and may include the same material (e.g., a metal material such as aluminum).

[0047] In the illustrated embodiment, the front surface plate 302 may include, at the long opposite side edges thereof, two first areas 310D, which are bent from the first surface 310A toward the rear surface plate 311 and extend seamlessly. In the illustrated embodiment (see FIG. 3), the rear surface plate 311 may include, at the long opposite side edges thereof, two second areas 310E, which are bent from the second surface 310B toward the front surface plate 302 and extend seamlessly. In some embodiments, the front surface plate 302 (or the rear surface plate 311) may include only one of the first areas 310D (or the second areas 310E). In another embodiment, some of the first areas 310D or the second areas 310E may not be included. In the above-described embodiments, when viewed from a side of the electronic device 101, the side surface bezel structure 318 may have a first thickness (or width) on the side where the first areas 310D or the second areas 310E are not included, and may have a second thickness, which is smaller than the first thickness, on the side where the first areas 310D or the second areas 310E are included.

[0048] According to an embodiment, the electronic device 101 may include at least one of a display 301, audio modules 303, 307, and 314, sensor modules 304, 316, and 319, camera modules 305, 312, and 313, key input devices 317, light-emitting elements 306, and connector holes 308 and 309. In some embodiments, at least one of the components (e.g., the key input devices 317 or the light-emitting elements 306) may be omitted from the electronic device 101, or other components may be additionally included in the electronic device 200.

[0049] According to an embodiment, the display 301 may be visually exposed through a substantial portion of, for example, the front surface plate 302. In some embodiments, at least a portion of the display 301 may be exposed through the front surface plate 302, which defines the first surface 310A and the first areas 310D of the side surface 310C. In some embodiments, the edges of the display 301 may be configured to be substantially the same as the shape of the periphery of the front surface plate 302 adjacent thereto. In another embodiment (not illustrated), the distance between the periphery of the display 301 and the periphery of the front surface plate 302 may be substantially constant in order to enlarge the exposed area of the display 301.

[0050] According to an embodiment, the surface of the housing 310 (or the front surface plate 302) may include a screen display area provided as the display 301 is visually exposed. As an example, the screen display area may include a first surface 310A and first areas 310D.

[0051] In another embodiment (not illustrated), recesses or openings may be provided in some portions of the screen display area of the display 301, and one or more of the audio module 314, the sensor modules 304, the camera modules 305, and the light-emitting elements 306, which are aligned with the recesses or the openings, may be included. In another embodiment (not illustrated), the rear surface of the screen display area of the display 301 may include at least one of the audio module 314, the sensor modules 304, the camera modules 305, a fingerprint sensor 316, and the light-emitting elements 306. In another embodiment (not illustrated), the display 301 may be coupled to or disposed adjacent to a touch-sensitive circuit, a pressure sensor capable of measuring a touch intensity (pressure), and/or a digitizer configured to detect an electromagnetic field-type stylus pen. In some embodiments, at least some of the sensor modules 304 and 519 and/or at least some of the key input devices 317 may be disposed in the first areas 310D and/or the second areas 310E.

[0052] According to an embodiment, the audio modules 303, 307, and 314 may include a microphone hole 303 and speaker holes 307 and 314. The microphone hole 303 may include a microphone disposed therein to acquire external sound, and in some embodiments, a plurality of microphones may be disposed therein to be able to detect the direction of sound. The speaker holes 307 and 314 may include an external speaker hole 307 and a communication receiver hole 314. In some embodiments, the speaker holes 307 and 314 and the microphone hole 303 may be implemented as a single hole, or a speaker may be included therein without the speaker holes 307 and 314 (e.g., a piezo speaker).

[0053] According to an embodiment, the sensor modules 314, 316, and 319 may generate electrical signals or data values corresponding to an internal operating state or an external environmental state of the electronic device 101. The sensor modules 304, 316, and 319 may include, for example, a first sensor module 304 (e.g., a proximity sensor), a second sensor module (not illustrated) (e.g., a fingerprint sensor) disposed on the first surface 310A of the housing 310, a third sensor module 319 (e.g., an HRM sensor), and/or a fourth sensor module 316 (e.g., a fingerprint sensor) disposed on the second surface 310B of the housing 310. The fingerprint sensor may be disposed not only on the first surface 310A of the housing 310 (e.g., the display 301), but also on the second surface 310B. The electronic device 101 may further include at least one of sensor modules (not illustrated), such as a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor 304.

[0054] According to an embodiment, the camera modules 305, 312, and 313 may include a first camera device 305 disposed on the first surface 310A of the electronic device 101, and a second camera device 312 and/or a flash 313 disposed on the second surface 310B. The camera modules 305 and 312 may include one or more lenses, an image sensor, and/or an image signal processor. The flash 313 may include, for example, a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (e.g., an infrared camera, a wide-angle lens, and a telephoto lens), and image sensors may be arranged on one surface of the electronic device 101.

[0055] According to an embodiment, the electronic device 101 may include a plurality of camera modules (e.g., a dual camera or a triple camera) having different properties (e.g., fields of view) or functions, respectively. For example, the plurality of camera modules 305 and 312 including lenses having different fields of view may be provided, and the electronic device 101 may control the change of the fields of view of the camera modules 305 and 312 executed therein based on a user's selection. For example, at least one of the plurality of camera modules 305 and 312 may be a wide-angle camera, and at least one of other camera modules may be a telephoto camera. Similarly, at least one of the plurality of camera modules 305 and 312 may be a front camera, and at least one of other camera modules may be a rear camera. In addition, the plurality of camera modules 305 and 312 may include at least one of a wide-angle camera, a telephoto camera, or an infrared (IR) camera (e.g., a time-of-flight (TOF) camera, or a structured light camera). According to an embodiment, the IR camera may be operated as at least a part of a sensor module. For example, the TOF camera may be operated as at least a part of a sensor module (not illustrated) for detecting a distance to an object.

[0056] According to an embodiment, the camera module 305 and/or the sensor module may be disposed from the inner space of the electronic device 101 to the front surface plate 302 of the display 301 to come into contact with the outer environment through a transparent area. In addition, some sensor modules (not illustrated) may be disposed in the inner space of the electronic device to perform the functions thereof without being visually exposed through the front surface plate 302.

[0057] According to an embodiment, the key input devices 317 may be disposed on the side surface 310C of the housing 310. In another embodiment, the electronic device 101 may not include some or all of the above-mentioned key input devices 317, and a key input device 317, which is not included, may be implemented in another form, such as a soft key, on the display 301. In some embodiments, the key input devices may include a sensor module 316 disposed on the second surface 310B of the housing 310.

[0058] According to an embodiment, the light-emitting element 306 may be disposed on, for example, the first surface 310A of the housing 310. The light-emitting element 306 may provide, for example, the state information of the electronic device 101 in an optical form. In another embodiment, the light-emitting element 306 may provide a light source that is operationally linked with, for example, the operation of the camera module 305. The light-emitting element 306 may include, for example, an LED, an IR LED, and a xenon lamp.

[0059] The connector holes 308 and 309 may include a first connector hole 308 capable of accommodating a connector (e.g., a USB connector) configured to transmit/receive power and/or data to/from an external electronic device, and a second connector hole (e.g., an earphone jack) 209 capable of accommodating a connector configured to transmit/receive an audio signal to/from an external electronic device.

[0060] FIG. 4 is an exploded perspective view illustrating an electronic device 101 according to various embodiments of the disclosure.

[0061] Referring to FIG. 4, an electronic device 101 (e.g., the electronic device 101 in FIGS. 1 to 4) may include a side surface bezel structure 331, a first support member 332 (e.g., a bracket), a front surface plate 320, a display 330, a printed circuit board 340, a battery 350, a second support member 360 (e.g., a rear case), an antenna 370, and a rear surface plate 380. In some embodiments, at least one of the components (e.g., the first support member 332 or the second support member 360) may be omitted from the electronic device 101, or other components may be additionally included in the electronic device 101. At least one of the components of the electronic device 101 may be the same as or similar to at least one of the components of the electronic device 101 of FIGS. 1 to 3, and a redundant description thereof is omitted below.

[0062] According to an embodiment, the first support member 332 may be disposed inside the electronic device 101 to be connected to the side surface bezel structure 331, or may be formed integrally with the side surface bezel structure 331. The first support member 332 may be made of, for example, a metal material and/or a non-metal (e.g., polymer) material. The first support member 332 may have one surface to which the display 330 is coupled, and the other surface to which the printed circuit board 340 is coupled. A processor, memory, and/or an interface may be mounted on the printed circuit board 340. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. According to an embodiment, the printed circuit board 340 may include a flexible printed circuit board-type radio frequency cable (FRC). For example, the printed circuit board 340 may be disposed on at least a portion of the first support member 332, and may be electrically connected to an antenna module (e.g., the antenna module 197 in FIG. 1) and a communication module (e.g., the communication module 190 in FIG. 1).

[0063] According to an embodiment, the memory may include, for example, volatile memory or nonvolatile memory.

[0064] According to an embodiment, the interface may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. For example, the interface may electrically or physically connect the electronic device 101 to an external electronic device, and include a USB connector, an SD card/MMC connector, or an audio connector.

[0065] According to an embodiment, the battery 350 is a device that supplies power to at least one component of the electronic device 101, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 350 may be disposed on substantially the same plane as, for example, the printed circuit board 340. The battery 350 may be integrally disposed inside the electronic device 101 or may be detachably disposed on the electronic device 101.

[0066] According to an embodiment, the second support member 360 (e.g., the rear case) may be disposed between the printed circuit board 340 and the antenna 370. For example, the second support member 360 may include one surface to which at least one of the printed circuit board 340 and the battery 350 is coupled, and the other surface to which the antenna 370 is coupled.

[0067] According to an embodiment, the antenna 370 may be disposed between the rear surface plate 380 and the display 350. The antenna 370 may include, for example, a near-field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. For example, the antenna 370 may execute short-range communication with an external device or may transmit/receive power required for charging to/from an external device in a wireless manner. In another embodiment, an antenna structure may be configured by a portion of the side surface bezel structure 331 and/or the first support member 332, or a combination thereof.

[0068] According to various embodiments of the disclosure, the electronic device may include a plurality of antenna modules 390. For example, some of the plurality of antenna modules 390 may be implemented in order to transmit and receive radio waves having different characteristics (provisionally referred to as radio waves of frequency bands A and B) for MIMO implementation. As another example, some of the plurality of antenna modules 390 may be configured, for example, to simultaneously transmit and receive radio waves having the same characteristics (provisionally referred to as radio waves having frequencies A1 and A2 in the frequency band A) for the purpose of diversity implementation. As another example, the remaining ones of the plurality of antenna modules 390 may be configured, for example, to simultaneously transmit and receive radio waves having the same characteristics (provisionally referred to as radio waves having frequencies B1 and B2 in the frequency band B) for diversity implementation. In an embodiment of the disclosure, the electronic device 101 may include two antenna modules, but, in another embodiment of the disclosure, the electronic device 101 may include four antenna modules so as to simultaneously implement MIMO and diversity. In still another embodiment, the electronic device 101 may include only one antenna module 390.

[0069] According to an embodiment, in consideration of the transmission/reception characteristics of radio waves, when one antenna module is disposed at a first position on the printed circuit board 340, another antenna module may be disposed at a second position, which is separated from the first position on the printed circuit board 340. As another example, one antenna module and another antenna module may be arranged in consideration of the mutual separation distance between the one antenna module and the another antenna module according to a diversity characteristic.

[0070] According to an embodiment, at least one antenna module 390 may include a wireless communication circuit that processes radio waves transmitted/received in an ultra-high-frequency band (e.g., 6 GHz or higher and 300 GHz or lower). A conductive plate of the at least one antenna module 390 may include, for example, a patch-type radiation conductor or a conductive plate having a dipole structure extending in one direction. A plurality of conductive plates may be arrayed to form an antenna array. For example, a chip in which a part of the wireless communication circuit is implemented (e.g., an integrated circuit chip) may be disposed on one side of the area in which the conductive plate is disposed or on the surface that faces away from the surface on which the conductive plate is disposed, and may be electrically connected to the conductive plate via wiring made of a printed circuit pattern.

[0071] The electronic device 101 disclosed herein has a bar-type or plate-type exterior, but the disclosure is not limited thereto. For example, the illustrated electronic device 101 may be a rollable electronic device or a foldable electronic device. According to a user's need, the rollable electronic device or the foldable electronic device may be used in the state in which the screen display area is expanded by unfolding the display or exposing a larger area of the display to the outside. In some embodiments, the electronic device 101 according to various embodiments disclosed herein may be interpreted as including not only a portable electronic device such as a smartphone, but also various other electronic devices such as a notebook computer or a camera.

[0072] FIGS. 5A to 5D illustrate the structure of the electronic device 101 illustrated in FIG. 4, according to various embodiments of the disclosure.

[0073] Referring to FIGS. 5A to 5D, the electronic device 101 may include a housing 310 including a first plate 520 (e.g., a front surface plate), a second plate (e.g., a rear surface plate or rear glass plate) spaced apart from the first plate and facing away from the first plate 520, and a side surface member 540 surrounding the space between the first plate 520 and the second plate 530.

[0074] According to an embodiment, the first plate 520 may include a transparent material including a glass plate. The second plate 530 may include a non-conductive material and/or a conductive material. In addition, the side surface member 540 may include a conductive material and/or a non-conductive material. In some embodiments, at least a portion of the side surface member 540 may be formed integrally with the second plate 530. In the illustrated embodiment, the side surface member 540 may include first to third insulating portions 541, 543, and 545 and first to third conductive portions 551, 553, and 555.

[0075] According to an embodiment, within the space, the electronic device 101 may include a display disposed to be visible through the first plate 520, a main printed circuit board (PCB) 571, and/or an a mid-plate (not illustrated), and may optionally further include various other components.

[0076] According to an embodiment, the electronic device 101 may include a first legacy antenna 551, a second legacy antenna 553, and a third legacy antenna 555 in the space and/or on a portion of the housing 310 (e.g., the side surface member 540). The first to third legacy antennas 551, 553, and 555 may be used for, for example, cellular communication (e.g., 2nd-generation (2G), 3G, 4G, or LTE), near-field communication (e.g., Wi-Fi, Bluetooth, or NFC), and/or global navigation satellite system (GNSS).

[0077] According to an embodiment, the electronic device 101 may include a first antenna module 561, a second antenna module 563, and a third antenna module 565 for forming directional beams. The antenna modules 561, 563, and 565 may be used for 5G network (e.g., the second cellular network 494 in FIG. 5) communication, mmWave communication, 60 GHz communication, or WiGig communication. The antenna modules 561, 563, and 565 may be disposed in the space to be spaced apart from metal members of the electronic device 101 (e.g., the housing 310, an internal component 573, and/or the first to third legacy antennas 551, 553, and 555) by a predetermined interval or more.

[0078] In the illustrated embodiment, the first antenna module 561 may be disposed at the upper end of the left side (-Y axis), the second antenna module 563 may be disposed at the middle of the upper end (X axis), and the third antenna module 565 may be disposed at the middle of the right side (Y axis). In another embodiment, the electronic device 101 may include additional antenna modules at additional positions (e.g., at the middle of the lower end (-X axis)), or some of the first to third antenna modules 561, 563, and 565 may be omitted. According to an embodiment, the first to third antenna modules 561, 563, and 565 may be electrically connected to at least one communication processor (e.g., the processor 120 in FIG. 5) on a main PCB 571 using a conductive line 581 (e.g., a coaxial cable or an FPCB).

[0079] Referring to FIG. 5B, which illustrates a cross section taken along line A-A' in FIG. 5A, some (e.g., a patch antenna array) of the antenna arrays of the first antenna module 561 may be disposed to emit radiation toward the second plate 530, and the remaining ones (e.g., a dipole antenna array) of the antenna arrays of the first antenna module 561 may be disposed to emit radiation through the first insulating portion 541. Referring to FIG. 5C, which illustrates a cross section taken along line B-B' in FIG. 5A, some (e.g., a patch antenna array) of the radiators of the second antenna module 563 may be disposed to emit radiation toward the second plate 530, and remaining ones (e.g., a dipole antenna array) of the radiators of the first antenna module 561 may be disposed to emit radiation through the second insulating portion 543.

[0080] In the illustrated embodiment, the second antenna module 563 may include a plurality printed circuit boards. For example, some (e.g., a patch antenna array) of the antenna arrays and remaining ones (e.g., a dipole antenna array) of the antenna arrays may be disposed on different printed circuit boards. According to an embodiment, the printed circuit boards may be connected via a flexible printed circuit board. The flexible printed circuit board may be disposed in the vicinity of electrical components 573 (e.g., a receiver, a speaker, sensors, a camera, an ear jack, or a button).

[0081] Referring to FIG. 5D, which illustrates a cross section taken along line C-C' in FIG. 5A, the third antenna module 565 may be disposed to face the side surface member 540 of the housing 310. Some (e.g., a dipole antenna array) of the antenna arrays of the third antenna module 565 may be disposed to emit radiation toward the second plate 530, and remaining ones (e.g., a patch antenna array) of the antenna arrays of the third antenna module 565 may be disposed to emit radiation through the third insulating portion 545.

[0082] FIGS. 6A to 6C are views illustrating an example of a structure of a third antenna module 565 described with reference to FIG. 5A according to various embodiments of the disclosure. FIG. 6A is a perspective view of the third antenna module 565 as viewed from one side, and FIG. 6B is a perspective view of the third antenna module 565 as viewed from the other side. FIG. 6C is a cross-sectional view taken along line B-B' of the third antenna module 565 illustrated in FIG. 6A.

[0083] Referring to FIGS. 6A to 6C, in an embodiment, the third antenna module 565 may include a printed circuit board 510, an antenna array 550, a radio frequency integrated circuit (RFIC) 552, and a power manage integrated circuit (PMIC) 554. Optionally, the third antenna module 565 may further include a shield member 590. In other embodiments, at least one of the above-mentioned components may be omitted, or at least two of the components may be integrally formed.

[0084] According to an embodiment, the printed circuit board 510 may include a plurality of conductive layers and a plurality of non-conductive layers laminated alternately with the conductive layers. The printed circuit board 510 may provide an electrical connection between various electronic components placed on the printed circuit board 510 and/or outside using wires and conductive vias provided in the conductive layers.

[0085] According to an embodiment, an antenna array 550 (e.g., the third antenna modules 565 in FIG. 5D) may include a plurality of antennas 532, 534, 536, and 538 arranged to form directional beams. As illustrated, the plurality of antennas may be arranged on the first surface of the printed circuit board 510. According to another embodiment, the antenna array 530 may be provided inside the printed circuit board 510. According to embodiments, the antenna array 530 may include a plurality of antenna arrays, which are different or the same in shape or type (e.g., dipole antenna arrays and/or patch antenna arrays).

[0086] According to an embodiment, the RFIC 552 may be arranged in another area (e.g., the second surface opposite to the first surface) of the printed circuit board 510 spaced apart from the antenna array 550. The RFIC may be configured to be capable of processing signals in a selected frequency band transmitted/received through the antenna array 550. According to an embodiment, during transmission, the RFIC 552 may convert a baseband signal acquired from a communication processor (not illustrated) into an RF signal in a designated band. During reception, the RFIC 552 may convert an RF signal received through the antenna array 550 into a baseband signal and transmit the baseband signal to a communication processor.

[0087] According to another embodiment, during transmission, the RFIC 552 may up-convert an IF signal (of, e.g., about 9 GHz to about 15 GHz) acquired from an intermediate frequency integrated circuit (IFIC) into an RF signal of a selected band. During reception, the RFIC 552 may down-convert an RF signal acquired via the antenna array 550 into an IF signal and transmit the IF signal to the IFIC.

[0088] According to an embodiment, the PMIC 554 may be disposed in another area (e.g., the second surface) of the printed circuit board 510 spaced apart from the antenna array 550. The PMIC may receive a voltage from a main PCB (not illustrated) and may provide required power for various components (e.g., the RFIC 552) on the antenna module.

[0089] According to an embodiment, the shield member 590 may be disposed on a portion (e.g., the second surface) of the printed circuit board 510 so as to electromagnetically shield at least one of the RFIC 552 or the PMIC 554. According to an embodiment, the shield member 590 may include a shield can.

[0090] Although not illustrated, in various embodiments, the third antenna module 565 may be electrically connected to another printed circuit board (e.g., the main circuit board) via a module interface. The module interface may include a connecting member, such as a coaxial cable connector, a board-to-board connector, an interposer, or a flexible printed circuit board (FPCB). Through the connecting member, the RFIC 552 and/or the PMIC 554 of the antenna module may be electrically connected to the printed circuit board.

[0091] FIG. 7A is a perspective view illustrating an antenna assembly 700 according to various embodiments of the disclosure. FIG. 7B is a perspective view illustrating an antenna assembly 700 according to an embodiment of the disclosure. FIG. 8 is a front view illustrating an antenna assembly 700 coupled to an electronic device 101 according to various embodiments of the disclosure. FIG. 9 is a cross-sectional view of the antenna assembly 700 in FIG. 8, taken along line A-A'. FIG. 10 is a cross-sectional view of the antenna assembly 700 in FIG. 8, taken along line B-B' including an FPCB lead-out portion.

[0092] Referring to FIGS. 7A to 10, the electronic device 101 may include a housing 600 and an antenna assembly 700 disposed in the inner space of the housing 600. The antenna assembly 700 may include an antenna circuit board 701, an antenna array 710 disposed on one surface of the antenna circuit board 701, a wireless communication circuit 702 electrically connected to the antenna array 710 and configured to transmit and/or receive RF signals, an antenna bracket 720 supporting the antenna array 710, and a support member 730 corresponding to at least a portion of the housing 600.

[0093] The configurations of the housing 600 and the antenna assembly 700 of FIGS. 7A to 10 may be partially or entirely identical to those of the housing 310 of FIGS. 2 to 4 and the third antenna module 565 in FIG. 6A.

[0094] In FIGS. 7 to 10, "X" in a 2-axis orthogonal coordinate system may indicate the length direction of the electronic device 101, and "Z" may indicate the thickness direction of the electronic device 101. In an embodiment of the disclosure, "Z" may indicate a first direction (the +Z direction) and the second direction (the -Z direction). In an embodiment of the disclosure, "X" may indicate a third direction (the +X direction) and a fourth direction (the -X direction).

[0095] According to various embodiments, the housing 600 may include a front surface cover, a rear surface cover facing away from the front surface cover, and a side surface member 630 surrounding the space between the front surface cover and the rear surface cover, and at least partially including a conductive portion.

[0096] According to various embodiments, the front surface cover of the housing 600 may be formed by a front surface plate (e.g., the front surface plate 302 in FIG. 2) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The rear surface cover may be formed by a substantially opaque rear surface plate (e.g., the rear surface plate 311 in FIG. 2). The rear surface plate may be made of, for example, coated or colored glass, ceramics, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these materials. The side surface member 630 may be formed by a side surface bezel structure (e.g., the side surface bezel structure 318 in FIG. 2) that is coupled to the front surface plate and the rear surface plate and includes metal and/or polymer. In some embodiments, the rear surface plate and the side surface bezel structure may be integrally formed, and may include the same material (e.g., a metal material such as aluminum).

[0097] According to various embodiments, the antenna array 710 of the antenna assembly 700 may include a plurality of antennas 711, 712, and 713 arranged to form directional beams. The antenna array 710 may be arranged such that the plurality of antennas 711, 712, and 713 can transmit and/or receive signals in the direction where the rear surface cover of the housing 600 is oriented (the first direction (the +Z direction)). In some embodiments, the antenna array 710 may be arranged such that the plurality of antennas 711, 712, and 713 can transmit and/or receive signals in the direction where the front surface cover of the housing 600 is oriented (the second direction (the -Z direction)).

[0098] According to various embodiments, the plurality of antennas 711, 712, and 713 may include a first antenna 711 including a first conductive element, a second antenna 712 including a second conductive element, and a third antenna 713 including a third conductive element. The lengths of the plurality of antennas 711, 712, and 713 in the thickness direction (the Z-axis direction) may be identical.

[0099] According to an embodiment, the lengths of the plurality of antennas 711, 712, and 713 in the thickness direction (the Z-axis direction)may be different. The first antenna may have a first thickness d1, the second antenna may have a second thickness d2, and the third antenna may have a third thickness (not illustrated). The first thickness d1 and the second thickness d2 may be different. The second thickness d2 and the third thickness (not illustrated) may be different. The third thickness (not illustrated) and the first thickness d1 may be different. However, the thicknesses of the plurality of antennas 711, 712, and 713 are not limited to the above-described embodiment, and may be variously designed and changed depending on the sizes or arrangements of the surrounding structures.

[0100] According to an embodiment, the separation distances of the plurality of antennas 711, 712, and 713 may be the same. For example, the separation distance between the first antenna 711 and the second antenna 712 and the separation distance between the second antenna 712 and the third antenna 713 may be identical. However, the separation distances between the plurality of antennas 711, 712, and 713 are not limited to the above-described embodiment, and the separation distances between the plurality of antennas 711, 712, and 713 may be different. The design of the separation distances may be changed in various ways depending on the sizes or arrangement of the surrounding structures.

[0101] According to various embodiments, the antenna bracket 720 of the antenna assembly 700 may be disposed to surround at least a portion of the antenna circuit board 701, the antenna array 710, and/or the wireless communication circuit 702. The antenna bracket 720 may serve as a bracket in which the antenna circuit board 701, the antenna array 710, and/or the wireless communication circuit 702 may be accommodated. The antenna bracket 720 may facilitate the movement of the antenna circuit board 701, the antenna array 710, and/or the wireless communication circuit 702 accommodated within the antenna bracket 720 into the inner space of the housing 600 during the assembly of antennas. According to an embodiment, the antenna bracket 720 may include a first surface 721 that faces one surface of the antenna array 710, a second surface 722 that is in contact with one end of the first surface 721 and perpendicular to the first surface 721, and a third surface 723 that is in contact with the other end of the first surface 721 and perpendicular to the first surface 721. The antenna array 710 may be disposed on the first surface 721 of the antenna bracket 720. The antenna bracket 720 may serve to support and protect the antenna array 710 from external stimuli and to fix the antenna array 710.

[0102] According to various embodiments, the support member 730 of the antenna assembly 700 may be configured to be in contact with the second surface 722 or the third surface 723 of the antenna bracket 720 and to correspond to at least a portion of the side surface member 630 of the housing 600. For example, the one surface of the side surface member 630 of the housing 600 exposed to the outside and one surface of the support member 730 exposed to the outside may correspond to each other. When a conductive portion is disposed in the direction where the beam patterns of the antennas are directed, the radiation direction of the antenna assembly 700 may be changed and/or distorted in a direction other than the desired direction by the conductive portion, thereby deteriorating the radiation performance of the antennas. Therefore, when the radiation direction of the plurality of antennas 711, 712, and 713 is in the fourth direction (the -X direction) which is directed to the side surface, the support member 730 disposed in the fourth direction (the -X direction) which is the radiation direction may be configured as a non-conductive portion to ensure smooth radiation. However, according to an embodiment of the disclosure, since the radiation direction of the plurality of antennas 711, 712, and 713 is directed to the rear surface (in the first direction (the +Z direction)), the support member 730 may include a conductive portion. When the support member 730 includes the conductive portion, the material is the same as that of the side surface member 630 made of a conductive material, ensuring that no aesthetic differences occur due to the material when viewed from the outside. In addition, by connecting the antenna assembly 700 to the outside, the manufacturing of the antenna assembly and the assembly of the electronic device may be facilitated.

[0103] According to various embodiments, the antenna circuit board 701, the antenna array 710, the wireless communication circuit 702, the antenna bracket 720, and the support member 730 of the antenna assembly 700 may be disposed successively without being spaced apart from each other. For example, the antenna bracket 720 may have a shape of a tray.

[0104] According to various embodiments, the side surface member 630 of the housing 600 may include a first portion 631 that has at least one surface exposed to the outside, a second portion 632 that is disposed adjacent to the rear cover 620 and extends in a third direction (the +X direction) from the first portion 631, a third portion 633 that extends in a second direction (the -Z direction) from the second portion 632, and a fourth portion 634 that extends in a fourth direction (the -X direction) from the third portion 633 and is in contact with the first portion 631.

[0105] According to various embodiments, the first portion 631 may include a first opening 6311 (e.g., the first opening 6311 in FIG. 12). When assembling the housing 600 of the electronic device 101 and the antenna assembly 700, the antenna assembly 700 may be inserted in the third direction (the +X direction) in the first opening 6311.

[0106] According to various embodiments, the second portion 632 may be configured to have a closed structure and may not include an opening. For example, the side surface member 630 of the housing 600 may have a first opening 6311 formed in the first portion 631, and the second portion 632, the third portion 633, and the fourth portion 634 may be integrally made. As another example, the side surface member 630 of the housing 600 may have a "c" shape. According to some embodiments, at least one of the second portion 632, the third portion 633, and the fourth portion 634 may include at least one hole for electrical coupling with other components.

[0107] According to an example of a general electronic device, an antenna module and a support member, which includes one surface facing laterally, may be separated, and the side surface member of the housing may be disposed between the antenna module and the support member. In addition, an opening may be formed in the second portion of the housing for assembling the antenna module. As a result, the overall area of the housing's side surface member may be narrow, and its rigidity may be weak.

[0108] According to various embodiments of the disclosure, since the antenna assembly 700 including the support member 730 is provided as a single assembly, the area occupied by the antenna assembly 700 may be small. In addition, since the second portion 632 of the housing side surface member 630 is configured to have a closed structure, and the second portion 632, the third portion 633, and the fourth portion 634 are integrally formed, the area of the side surface member 630 surrounding the antenna assembly 700 may be increased. As a result, the rigidity of the housing 600 may be secured. For example, compared to the rigidity of a housing that generally occupies a small area, the rigidity of the housing 600 of the disclosure may be improved by about 10 to 15%. For example, compared to the rigidity of a housing of a general electronic device, the rigidity of the housing 600 of the disclosure may be improved by about 13%.

[0109] In addition, the total length in the length direction (the X-axis direction) of the side surface member 630 of the housing 600 surrounding the antenna assembly 700 may be reduced. For example, the length of one surface of the antenna array 710 that transmits and receives signals (e.g., length in the X-axis direction in FIG. 9) may be about 3 to 4 mm, and the length in the thickness direction perpendicular to the one surface (e.g., the length in the Z-axis direction of FIG. 9) may be about 2 to 3 mm. For example, the length of one surface of the antenna array 710 that transmits and receives signals (e.g., length in the X-axis direction in FIG. 9) may be about 3.5 mm, and the length in the thickness direction perpendicular to the one surface (e.g., the length in the Z-axis direction of FIG. 9) may be about 2.44 mm. The length of one surface (e.g., the length in the X-axis direction of FIG. 9) of the antenna array 710 that transmits and receives signals is longer. Thus, when the antenna radiation direction changes from being directed to the side surface (in the fourth direction (-X)) to being directed to the rear surface (in the first direction (the +Z direction)), the length of the antenna array 710 in the length direction (e.g., the length in the X-axis direction of FIG. 9) may increase. However, unlike general electronic devices, since the antenna assembly 700 including the antenna array 710 is configured as a single assembly, the length in the length direction (e.g., the X-axis direction in FIG. 9) of the side surface member 630 of the housing 600 surrounding the antenna assembly 700 may decrease. This may influence the mounting length of the battery disposed on the side surface of the antenna assembly 700, and the mounting length of the battery may be maintained or increased, thereby maintaining and/or improving battery performance.

[0110] According to an embodiment, referring to FIG. 10, the electronic device 101 may further include an attachment member 800. The attachment member 800 may be disposed on the second portion 632 of the side surface member 630 of the housing 600. The attachment member 800 may be attached between the second portion 632 of the side surface member 630 and the rear surface cover 620 of the housing 600. Since the second portion 632 of the disclosure is formed to have a closed structure unlike an electronic device that includes an opening in the second portion of a general housing, the attachment area of the attachment member 800 may increase. For example, the length of the attachment member 800 in the length direction (e.g., the X-axis direction in FIG. 9) may increase. Therefore, the attachment force between the housings 600 may be strengthened.

[0111] According to another embodiment, referring to FIG. 10, the electronic device 101 may further include a first waterproof member 810. The first waterproof member 810 may be disposed on the second portion 632 of the side surface member 630 of the housing 600. The first waterproof member 810 may be attached between the second portion 632 of the side surface member 630 and the rear surface cover 620 of the housing 600. Since the second portion 632 of the disclosure is formed to have a closed structure unlike an electronic device that includes an opening in the second portion of a general housing, the attachment area of the first waterproof member 810 may increase. For example, the length of the first waterproof member 810 in the length direction (e.g., the X-axis direction in FIG. 9) may increase. Accordingly, it is possible to strengthen waterproof performance of the electronic device.

[0112] According to an embodiment, referring to FIG. 10, in order to fix the position of the support member 730 and the side surface member 630 and/or the antenna bracket 720 of the electronic device 101, a second waterproof member 820 may be further included on at least one surface where the support member 730 and the side surface member 630 and/or the antenna bracket 720 come into contact. The second waterproof member 820 may be a tape that wraps around the outer surface of the support member 730 to prevent flooding and fix the position of the support member 730.

[0113] FIG. 11 is a perspective view illustrating an assembly process of an antenna assembly 700 according to various embodiments of the disclosure. FIG. 12 is a perspective view illustrating the antenna assembly 700 disposed in an electronic device to correspond to a first opening 6311 included in a side surface member 630 of a housing 600.

[0114] Referring to FIGS. 11 to 12, an electronic device 101 may include the housing 600 and the antenna assembly 700 disposed in the inner space of the housing 600. The antenna assembly 700 may include an antenna circuit board 701, an antenna array 710 disposed on one surface of the antenna circuit board 701, a wireless communication circuit 702 electrically connected to the antenna array 710 and configured to transmit and/or receive RF signals, an antenna bracket 720 supporting the antenna array 710, and a support member 730 corresponding to at least a portion of the housing 600.

[0115] The configurations of the housing 600 and the antenna assembly 700 of FIGS. 11 and 12 may be partially or entirely identical to those of the housing 310 of FIGS. 2 to 4 and the antenna assembly 700 in FIGS. 7A to 11.

[0116] In FIGS. 11 and 12, "X" may indicate the length direction of the electronic device 101, "Y" may indicate the width direction of the electronic device 101, and "Z" may indicate the thickness direction of the electronic device 101. In an embodiment of the disclosure, "Z" may indicate a first direction (the +Z direction) and the second direction (the -Z direction). In an embodiment of the disclosure, "X" may indicate a third direction (the +X direction) and a fourth direction (the -X direction). In an embodiment of the disclosure, "Y" may indicate a fifth direction (the +Z direction) and a sixth direction (-Z).

[0117] According to various embodiments, the support member 730 may include a plurality of protrusions 731 protruding in the third direction (the +X direction) on one surface oriented in the third direction (the +X direction) that is not exposed to the outside. For example, the support member may include three protrusions 731 arranged at a predetermined interval. According to various embodiments, the second side surface 722 of the antenna bracket 720 to come into contact with the support member 730 may include a plurality of holes 724. The plurality of holes 724 may correspond to the plurality of protrusions 731. Therefore, the support member 730 and the antenna bracket 720 may be assembled by assembling the plurality of protrusions 731 of the support member 730 and the plurality of holes 724 of the antenna bracket 720 to correspond to each other. The support member 730 and the antenna bracket 720 of the antenna assembly 700 may be assembled without screws. Therefore, the number of components to be used may be reduced.

[0118] According to various embodiments, the antenna circuit board 701, the antenna array 710 disposed on one surface of the antenna circuit board 701 oriented in the first direction (the +Z direction), and the wireless communication circuit 702 disposed on one surface of the antenna circuit board 701 oriented in the second direction (the -Z direction) may be formed as a single assembly. According to an embodiment, a module interface 703 may be disposed on one surface of the antenna circuit board 701 oriented in the first direction (the +Z direction). The antenna circuit board 701 may be electrically connected to another printed circuit board (e.g., a main circuit board) via the module interface 703. The module interface 703 may include a connecting member, such as a coaxial cable connector, a board-to-board connector, an interposer, or a flexible printed circuit board (FPCB). Through the connecting member, the RFIC 552 and/or the PMIC 554 of the antenna module may be electrically connected to the printed circuit board.

[0119] According to various embodiments, an assembly of the antenna circuit board 701, the antenna array 710, the wireless communication circuit 702, and the module interface 703 may be disposed on a first surface 721 of an antenna bracket 720.

[0120] According to various embodiments, the antenna assembly 700 may be assembled to the electronic device 101 through a first opening 6311 formed in a first portion 631 of a side surface member 630 of a housing.

[0121] FIG. 13 is a perspective view illustrating an inner antenna assembly 700b according to another embodiment of the disclosure. FIG. 14 is a perspective view illustrating the inner antenna assembly 700b disposed in an electronic device to correspond to a first opening 6311 included in a side surface member 630 inside a housing 600 according to another embodiment of the disclosure.

[0122] Referring to FIGS. 13 and 14, the electronic device 101 may include a housing 600 and an inner antenna assembly 700b disposed in the inner space of the housing 600. The inner antenna assembly 700b may include an antenna circuit board (not illustrated), an antenna array 710 disposed on one surface of the antenna circuit board (not illustrated), a wireless communication circuit (not illustrated) electrically connected to the antenna array 710 and configured to transmit and/or receive RF signals, and an inner antenna bracket 740 supporting the antenna array 710.

[0123] The configurations of the housing 600, the inner antenna assembly 700b, the antenna circuit board (not illustrated), the antenna array 710, the wireless communication circuit (not illustrated), and the inner antenna bracket 740 in FIGS. 13 to 14 may be partially or entirely identical to those of the housing 310 in FIGS. 2 to 4, and the antenna assembly 700, the antenna circuit board 701, the antenna array 710, the wireless communication circuit 702, and the antenna bracket 720 in FIGS. 7A to 10.

[0124] In FIGS. 13 and 14, "X" may indicate the length direction of the electronic device 101, "Y" may indicate the width direction of the electronic device 101, and "Z" may indicate the thickness direction of the electronic device 101. In an embodiment of the disclosure, "Z" may indicate a first direction (the +Z direction) and the second direction (the -Z direction). In an embodiment of the disclosure, "X" may indicate a third direction (the +X direction) and a fourth direction (the -X direction). In an embodiment of the disclosure, "Y" may indicate a fifth direction (the +Z direction) and a sixth direction (-Z).

[0125] According to another embodiment, the inner antenna bracket 740 of the antenna assembly 700b may be disposed to surround at least a portion of the antenna circuit board (not illustrated), the antenna array 710, and/or the wireless communication circuit (not illustrated). The inner antenna bracket 740 may serve as a bracket in which the antenna circuit board (not illustrated), the antenna array 710, and/or the wireless communication circuit (not illustrated) may be accommodated. The inner antenna bracket 740 may facilitate the movement of the antenna circuit board (not illustrated), the antenna array 710, and/or the wireless communication circuit (not illustrated) accommodated within the inner antenna bracket 740 into the inner space of the housing 600 during the assembly of antennas. According to another embodiment, the inner antenna bracket 740 may include a first surface 741 that faces one surface of the antenna array 710, a second surface 742 that is in contact with one end of the first surface 741 and perpendicular to the first surface 741, and a third surface 743 that is in contact with the other end of the first surface 741 and perpendicular to the first surface 741. The antenna array 710 may be disposed on the first surface 741 of the inner antenna bracket 740. The inner antenna bracket 740 may serve to support and protect the antenna array 710 from external stimuli and to fix the antenna array 710.

[0126] According to another embodiment, referring to FIG. 14, when assembling the inner antenna bracket 740 to the housing 600 of the electronic device 101, the inner antenna assembly 700b may be inserted in the fourth direction (the -X direction) in the first opening 6311. For example, when assembling the inner antenna bracket 740 to the housing 600 of the electronic device 101, the inner antenna assembly 700b may be inserted from the interior of the housing 600 into the first opening 6311.

[0127] An electronic device 101 according to various embodiments of the disclosure may include a housing 600 that includes a front surface cover 610, a rear surface cover 620 facing away from the front surface cover 610, and a side surface member 630 surrounding the space between the front surface cover 610 and the rear surface cover 620 and at least partially including a conductive portion, and an antenna assembly 700 disposed within the space. The antenna assembly 700 may further include an antenna circuit board 701, an antenna array 710 disposed on one surface of the antenna circuit board 701 and configured to transmit and/or receive a signal in a first direction toward the rear surface cover 620, a wireless communication circuit 702 electrically connected to the antenna array 710 and configured to transmit and/or receive a radio frequency (RF) signal, an antenna bracket 720 including a first surface 721 facing the one surface of the antenna array 710 and a second surface 722 in contact with one end of the first surface 721 and perpendicular to the first surface 721, the antenna bracket 720 being configured to support the antenna array 710, and a support member 730 in contact with the second surface 722 of the antenna bracket 720 and corresponding to at least a portion of the side surface member 630 of the housing 600.

[0128] According to various embodiments, the support member 730 may include a conductive portion corresponding to the side surface member 630.

[0129] According to various embodiments, the side surface member 630 may include a first portion 631 having at least one surface exposed to the outside and having a first opening 6311 formed therein, a second portion 632 disposed adjacent to the rear surface cover 620 and extending from the first portion 631 in a third direction perpendicular to the first direction, a third portion 633 extending in a second direction opposite to the first direction from the second portion 632, and a fourth portion 634 extending in a fourth direction opposite to the third direction from the third portion 633 and in contact with the first portion 631.

[0130] According to various embodiments, the support member 730 may include a plurality of protrusions, and the antenna bracket 720 may include a plurality of holes 724 corresponding to the the plurality of protrusions.

[0131] According to various embodiments, the first portion 631, the second portion 632, the third portion 633, and the fourth portion 634 of the side surface member may be integrally made. According to various embodiments, the side surface member 630 may have a "

" shape.

[0132] According to various embodiments, the electronic device may further include an attachment member disposed between the second portion 632 of the side surface member 630 and the rear surface cover 620.

[0133] According to various embodiments, the electronic device may further include a waterproof member disposed between the second portion 632 of the side surface member 630 and the rear surface cover 620.

[0134] According to various embodiments, the antenna array 710 may include a first antenna including a first conductive element and having a first thickness, and a second antenna including a second conductive element and having a second thickness, and the first thickness and the second thickness may be different.

[0135] According to various embodiments, the antenna bracket 720 may further include a third surface 723 in contact with the other end of the first surface 721 and perpendicular to the first surface 721.

[0136] According to various embodiments, a plurality of antennas may be configured to transmit and/or receive a signal having a predetermined frequency band in a range of 6 GHz to 300 GHz.

[0137] An antenna assembly 700 disposed within a housing 600 according to various embodiments of the disclosure may further include an antenna circuit board 701, an antenna array 710 disposed on one surface of the antenna circuit board 701 and configured to transmit and/or receive a signal in a first direction toward the rear surface cover 620, a wireless communication circuit 702 electrically connected to the antenna array 710 and configured to transmit and/or receive a radio frequency (RF) signal, an antenna bracket 720 including a first surface 721 facing the one surface of the antenna array 710 and a second surface 722 in contact with one end of the first surface 721 and perpendicular to the first surface 721, the antenna bracket 720 being configured to support the antenna array 710, and a support member 730 in contact with the second surface 722 of the antenna bracket 720 and corresponding to at least a portion of the side surface member 630 of the housing 600.

[0138] According to various embodiments, the support member 730 may include a conductive portion corresponding to the side surface member 630.

[0139] According to various embodiments, the antenna array 710 may include a first antenna including a first conductive element and having a first thickness, and a second antenna including a second conductive element and having a second thickness, and the first thickness and the second thickness may be different.

[0140] According to various embodiments, the antenna bracket 720 may further include a third surface 723 in contact with the other end of the first surface 721 and perpendicular to the first surface 721.

[0141] According to various embodiments, the antenna array 710 may be configured to transmit and/or receive a signal having a predetermined frequency band in a range of 6 GHz to 300 GHz.

[0142] An electronic device 101 according to various embodiments of the disclosure may further include a housing 600 including a front surface cover 610, a rear surface cover 620 facing away from the front surface cover 610, and a side surface member 630 surrounding the space between the front surface cover 610 and the rear cover 620 and including at least a partially conductive portion, an antenna assembly 700 including an antenna array 710 disposed within the space and configured to transmit and/or receive a signal in a first direction toward the rear cover 620, an antenna bracket 720 including a first surface 721 facing one surface of the antenna array 710, and a second surface 722 in contact with one end of the first surface 721 and perpendicular to the first surface 721, and configured to support the antenna array 710, and a support member 730 in contact with the second surface 722 of the antenna bracket 720 and corresponding to at least a portion of the side surface member 630 of the housing 600.

[0143] According to various embodiments, the side surface member 630 may include a first portion 631 having at least one surface exposed to the outside and having a first opening 6311 formed therein, a second portion 632 disposed adjacent to the rear surface cover 620 and extending from the first portion 631 in a third direction perpendicular to the first direction, a third portion 633 extending from the second portion 632 in a second direction opposite to the first direction, and a fourth portion 634 extending in a fourth direction opposite to the third direction from the third portion 633 and in contact with the first portion 631.

[0144] According to various embodiments, the support member 730 may include a plurality of protrusions, and the antenna bracket 720 may include a plurality of holes 724 corresponding to the plurality of protrusions.

[0145] According to various embodiments, the first portion 631, the second portion 632, the third portion 633, and the fourth portion 634 of the side surface member may be integrally made.

[0146] It may be apparent to a person ordinarily skilled in the technical field to which the disclosure belongs that an antenna assembly 700 according to various embodiments of the disclosure and an electronic device 101 including the same are not limited by the above-described embodiments and drawings, and various substitutions, modifications, and changes can be made within the technical scope of the disclosure.

Claims

1. An electronic device comprising:

a housing comprising a front surface cover, a rear surface cover facing away from the front surface cover, and a side surface member surrounding a space between the front surface cover and the rear surface cover and at least partially comprising a conductive portion; and

an antenna assembly disposed within the space,

wherein the antenna assembly further comprises:

an antenna circuit board;

an antenna array disposed on one surface of the antenna circuit board and configured to transmit and/or receive a signal in a first direction toward the rear surface cover;

a wireless communication circuit electrically connected to the antenna array and configured to transmit and/or receive a radio frequency (RF) signal;

an antenna bracket comprising a first surface facing the one surface of the antenna array and a second surface in contact with one end of the first surface and perpendicular to the first surface, the antenna bracket being configured to support the antenna array; and

a support member in contact with the second surface of the antenna bracket and corresponding to at least a portion of the side surface member of the housing.

2. The electronic device of claim 1, wherein the support member comprises a conductive portion corresponding to the side surface member.

3. The electronic device of claim 1, wherein the side surface member comprises:

a first portion having at least one surface exposed outside and having a first opening formed therein;

a second portion disposed adjacent to the rear surface cover and extending from the first portion in a third direction perpendicular to the first direction;

a third portion extending in a second direction opposite to the first direction from the second portion; and

a fourth portion extending in a fourth direction opposite to the third direction from the third portion and in contact with the first portion.

4. The electronic device of claim 1, wherein the support member comprises a plurality of protrusions, and
wherein the antenna bracket comprises a plurality of hole corresponding to the plurality of protrusions.

5. The electronic device of claim 3, wherein the first portion, the second portion, the third portion, and the fourth portion of the side surface member are integrally made.

6. The electronic device of claim 3, wherein the side surface member has a "c" shape.

7. The electronic device of claim 3, further comprising:
an attachment member disposed between the second portion of the side surface member and the rear surface cover.

8. The electronic device of claim 3, further comprising:
a waterproof member disposed between the second portion of the side surface member and the rear surface cover.

9. The electronic device of claim 1, wherein the antenna array comprises:

a first antenna comprising a first conductive element and having a first thickness; and

a second antenna comprising a second conductive element and having a second thickness, and

wherein the first thickness and the second thickness are different.

10. The electronic device of claim 1, wherein the antenna bracket further comprises a third surface that is in contact with the other end of the first surface and is perpendicular to the first surface.

11. The electronic device of claim 1, wherein the antenna array is configured to transmit and/or receive a signal having a predetermined frequency band in a range of 6 GHz to 300 GHz.

12. An antenna assembly disposed within a housing that comprises a front surface cover, a rear surface cover facing away from the front surface cover, and a side surface member surrounding a space between the front surface cover and the rear surface cover and at least partially comprising a conductive portion, the antenna assembly further comprising:

an antenna circuit board;

an antenna array disposed on one surface of the antenna circuit board and configured to transmit and/or receive a signal in a first direction toward the rear surface cover;

a wireless communication circuit electrically connected to the antenna array and configured to transmit and/or receive a radio frequency (RF) signal;

an antenna bracket comprising a first surface facing the one surface of the antenna array and a second surface in contact with one end of the first surface and perpendicular to the first surface, the antenna bracket being configured to support the antenna array; and

a support member in contact with the second surface of the antenna bracket and corresponding to at least a portion of the side surface member of the housing.

13. The antenna assembly of claim 12, wherein the support member comprises a conductive portion corresponding to the side surface member.

14. The antenna assembly of claim 12, wherein the antenna array comprises:

a first antenna comprising a first conductive element and having a first thickness; and

a second antenna comprising a second conductive element and having a second thickness, and

wherein the first thickness and the second thickness are different.

15. The antenna assembly of claim 12, wherein the antenna bracket further comprises a third surface in contact with the other end of the first surface and perpendicular to the first surface.

Drawing