(19)

(11)

EP 4 487 515 A1

(12)

(43) Date of publication: 08.01.2025 Bulletin 2025/02 (21) Application number: 23711237.0 (22) Date of filing: 14.02.2023

(51) International Patent Classification (IPC):  H04L 5/00(2006.01) H04W 72/00(2023.01) (52) Cooperative Patent Classification (CPC): H04L 5/0094; H04L 5/0048; H04L 5/0053; H04L 5/0064 (86) International application number: PCT/US2023/013060 (87) International publication number: WO 2023/167781 (07.09.2023 Gazette 2023/36)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: KH MA MD TN (30) Priority: 04.03.2022 US 202217640651 07.03.2022 US 202217688732 (71) Applicant: QUALCOMM INCORPORATED San Diego, California 92121-1714 (US)	(72) Inventors: MANOLAKOS, Alexandros San Diego, California 92121 (US) DUAN, Weimin San Diego, California 92121 (US) SRIDHARAN, Gokul San Diego, California 92121 (US) CHEN, Wanshi San Diego, California 92121 (US) (74) Representative: Reddie & Grose LLP  The White Chapel Building 10 Whitechapel High Street London E1 8QS London E1 8QS (GB)