(19)
(11) EP 4 497 304 A1

(12)

(43) Date of publication:
29.01.2025 Bulletin 2025/05

(21) Application number: 22727312.5

(22) Date of filing: 04.05.2022
(51) International Patent Classification (IPC): 
H05K 1/18(2006.01)
H05K 3/42(2006.01)
 H05K 1/02(2006.01)
(52) Cooperative Patent Classification (CPC):
H05K 1/185; H05K 2201/10166; H05K 1/0263; H05K 3/429; H05K 2203/063
(86) International application number:
PCT/EP2022/062058
(87) International publication number:
WO 2023/213394 (09.11.2023 Gazette 2023/45)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(71) Applicant: Huawei Digital Power Technologies Co., Ltd.
Shenzhen, Guangdong 518043 (CN)

(72) Inventors:
  • MUNDING, Andreas
    80992 Munich (DE)
  • PALM, Lasse Petteri
    80992 Munich (DE)

(74) Representative: Maiwald GmbH 
Engineering Elisenhof Elisenstrasse 3
80335 München
80335 München (DE)

   


(54) MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD FOR ITS PRODUCTION