(19)
(11) EP 4 504 843 A1

(12)

(43) Date of publication:
12.02.2025 Bulletin 2025/07

(21) Application number: 22936183.7

(22) Date of filing: 08.04.2022
(51) International Patent Classification (IPC): 
C09D 183/04(2006.01)
C09D 183/07(2006.01)
C08K 3/08(2006.01)
C09D 183/05(2006.01)
C08K 3/04(2006.01)
(52) Cooperative Patent Classification (CPC):
C08K 2201/003; C08K 2003/282; C08K 2003/2227; C08K 3/36; C08G 77/20; C08G 77/12; C08L 83/04
 
C-Sets:
  1. C08L 83/04, C08K 13/04, C08L 83/00;
  2. C08L 83/04, C08K 3/28, C08L 83/00;
  3. C08L 83/04, C08K 5/56, C08L 83/00;
  4. C08L 83/04, C08K 2201/001, C08L 83/00;
  5. C08L 83/04, C08K 3/04, C08L 83/00;
  6. C08L 83/04, C08K 9/06, C08L 83/00;

(86) International application number:
PCT/CN2022/085861
(87) International publication number:
WO 2023/193245 (12.10.2023 Gazette 2023/41)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(71) Applicant: Henkel AG & Co. KGaA
40589 Düsseldorf (DE)

(72) Inventors:
  • LI, Dan
    Shanghai 201203 (CN)
  • SHEN, Ling
    Shanghai 201203 (CN)
  • YU, Hengda
    Shanghai 201203 (CN)
  • ZHU, Xingyu
    Shanghai 201201 (CN)
  • GAO, Wenting
    Shanghai 201203 (CN)
  • LI, Yongming
    Shanghai 201203 (CN)

   


(54) THERMALLY CONDUCTIVE SILICONE COMPOSITION