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(11)

EP 4 505 616 A1

(12)

(43) Date of publication: 12.02.2025 Bulletin 2025/07 (21) Application number: 23719975.7 (22) Date of filing: 30.03.2023

(51) International Patent Classification (IPC):  H04B 7/0404(2017.01) H04W 52/02(2009.01) H04B 7/06(2006.01) (52) Cooperative Patent Classification (CPC): H04B 7/0404; H04B 7/06952; H04B 7/06956; H04B 7/06958; H04B 7/01; H04L 25/0202; H04W 76/28; H04W 52/0216 (86) International application number: PCT/US2023/016798 (87) International publication number: WO 2023/196152 (12.10.2023 Gazette 2023/41)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: KH MA MD TN (30) Priority: 04.04.2022 US 202263362434 P 29.03.2023 US 202318192235 (71) Applicant: QUALCOMM Incorporated San Diego, CA 92121-1714 (US)	(72) Inventors: ZHU, Jun San Diego, California 92121 (US) CHALLA, Raghu Narayan San Diego, California 92121 (US) BANISTER, Brian Clarke San Diego, California 92121 (US) (74) Representative: Bardehle Pagenberg Partnerschaft mbB Patentanwälte Rechtsanwälte  Prinzregentenplatz 7 81675 München 81675 München (DE)