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EP 4 511 997 A1

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(43) Date of publication: 26.02.2025 Bulletin 2025/09 (21) Application number: 23792461.8 (22) Date of filing: 19.04.2023

(51) International Patent Classification (IPC):  H04B 7/06(2006.01) H04W 72/231(2023.01) H04W 24/02(2009.01) H04W 84/04(2009.01) H04B 7/08(2006.01) H04W 72/232(2023.01) H04B 7/155(2006.01) (52) Cooperative Patent Classification (CPC): H04W 24/02; H04L 1/08; H04W 84/047; H04L 1/0026; H04L 2001/0097; H04B 7/15528; H04B 7/0617; H04B 7/06952; H04B 7/088 (86) International application number: PCT/US2023/019054 (87) International publication number: WO 2023/205202 (26.10.2023 Gazette 2023/43)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: KH MA MD TN (30) Priority: 20.04.2022 WO PCT/CN2022/087904 05.08.2022 US 202263395643 P 29.09.2022 US 202263411403 P 13.10.2022 US 202263415762 P 19.01.2023 WO PCT/CN2023/073061 (71) Applicant: INTEL Corporation Santa Clara, CA 95054 (US)

(72) Inventors: WANG, Yi Beijing 10000 (CN) LI, Yingyang Beijing 100190 (CN) DAVYDOV, Alexei Novgorod, 603132 (RU) WANG, Guotong Beijing 100190 (CN) PANTELEEV, Sergey Maynooth, W23 T86C (IE) (74) Representative: HGF  HGF Limited 1 City Walk Leeds LS11 9DX Leeds LS11 9DX (GB)