(19)

(11)

EP 4 512 020 A1

(12)

(43) Date of publication: 26.02.2025 Bulletin 2025/09 (21) Application number: 23722225.2 (22) Date of filing: 17.04.2023

(51) International Patent Classification (IPC):  H04L 1/1607(2023.01) H04L 1/1867(2023.01) H04L 1/1829(2023.01) H04L 1/08(2006.01) (52) Cooperative Patent Classification (CPC): H04L 1/1896; H04L 1/1854; H04L 1/1664; H04L 1/08 (86) International application number: PCT/US2023/018875 (87) International publication number: WO 2023/205102 (26.10.2023 Gazette 2023/43)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: KH MA MD TN (30) Priority: 22.04.2022 US 202263363424 P 31.10.2022 US 202218051491 (71) Applicant: QUALCOMM INCORPORATED San Diego, California 92121-1714 (US)	(72) Inventors: HUANG, Yi San Diego, California 92121 (US) RUNGTA, Pranay Sudeep San Diego, California 92121 (US) GAAL, Peter San Diego, California 92121 (US) YANG, Wei San Diego, California 92121 (US) (74) Representative: Jaeger, Michael David  Maucher Jenkins Seventh Floor Offices Artillery House 11-19 Artillery Row London SW1P 1RT London SW1P 1RT (GB)